Abstract:
A self-aligned electrical interconnect for two assembled perpendicular semiconductive chips is formed by a slot in a carrier chip having a notch with a metal trace. The other device chip is perpendicularly placed in the slot and has a matching metal trace. The chips are then bonded together by the traces to provide for fine perpendicular alignment of the assembled chips.
Abstract:
A self-aligned electrical interconnect for two assembled perpendicular semiconductive chips is formed by a slot in a carrier chip having a notch with a metal trace. The other device chip is perpendicularly placed in the slot and has a matching metal trace. The chips are then bonded together by the traces to provide for fine perpendicular alignment of the assembled chips.
Abstract:
A fiber optic switch using MEMS is scalable by the use of a matrix of cross-points located at the intersection of all possible input and output light paths. Cross-points are formed by a MEMS procedure where a digitally movable mirror intersects a light path to provide a digital switching action with the remaining cross-point mirrors being moved out of position to provide through transmission.