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    Self-assembled vertically aligned multi-chip module
    1.
    发明授权
    Self-assembled vertically aligned multi-chip module 有权
    自组装垂直排列的多芯片模块

    公开(公告)号：US09519105B1

    公开(公告)日：2016-12-13

    申请号：US15188403

    申请日：2016-06-21

    Applicant: Oracle International Corporation

    Inventor： Ivan Shubin ,  Xuezhe Zheng ,  Jin Hyoung Lee ,  Kannan Raj ,  Ashok V. Krishnamoorthy

    IPC: G02B6/26 ,  G02B6/13 ,  G02B6/42 ,  G02B6/12 ,  H01S5/30 ,  H01L33/58 ,  G02B6/43

    CPC classification number: G02B6/13 ,  G02B6/12 ,  G02B6/4228 ,  G02B6/4239 ,  G02B6/4257 ,  G02B6/43 ,  G02B2006/12061 ,  H01L33/58 ,  H01S5/3013

    Abstract: A multi-chip module (MCM) is described. This MCM includes two substrates that are passively self-assembled on another substrate using hydrophilic and hydrophobic materials on facing surfaces of the substrates and liquid surface tension as the restoring force. In particular, regions with a hydrophilic material on the two substrates overlap regions with the hydrophilic material on the other substrate. These regions on the other substrate may be surrounded by a region with a hydrophobic material. In addition, spacers on a surface of at least one of the two substrates may align optical waveguides disposed on the two substrates, so that the optical waveguides are coplanar. This fabrication technique may allow low-loss hybrid optical sources to be fabricated by edge coupling the two substrates. For example, a first of the two substrates may be a III/V compound semiconductor and a second of the two substrates may be a silicon-on-insulator photonic chip.

    Abstract translation: 描述了多芯片模块（MCM）。 该MCM包括两个衬底，其被动地自组装在另一衬底上，使用在衬底的相对表面上的亲水和疏水材料和作为恢复力的液体表面张力。 特别地，在两个基底上具有亲水性材料的区域与另一个基底上的亲水材料重叠区域。 另一个衬底上的这些区域可以被具有疏水性材料的区域包围。 此外，两个基板中的至少一个的表面上的间隔物可以对准设置在两个基板上的光波导，使得光波导是共面的。 这种制造技术可以允许通过边缘耦合两个基板来制造低损耗混合光源。 例如，两个基板中的第一个可以是III / V化合物半导体，并且两个基板中的第二个可以是绝缘体上硅光子芯片。

    INTEGRATED CHIP PACKAGE WITH OPTICAL INTERFACE
    4.
    发明申请
    INTEGRATED CHIP PACKAGE WITH OPTICAL INTERFACE 有权
    具有光接口的集成芯片包

    公开(公告)号：US20160085038A1

    公开(公告)日：2016-03-24

    申请号：US14492816

    申请日：2014-09-22

    Applicant: Oracle International Corporation

    Inventor： Patrick J. Decker ,  Kannan Raj ,  Alan T. Hilton-Nickel

    IPC: G02B6/42 ,  G02B6/43 ,  G02B6/122

    CPC classification number: G02B6/4204 ,  G02B6/423 ,  G02B6/4269 ,  G02B6/428

    Abstract: A chip package includes an integrated circuit and an optical integrated circuit (such as a hybrid integrated circuit) with an optical source and/or an optical receiver. The integrated circuit and the optical integrated circuit may be proximate to each other on opposite sides of an interposer in the chip package. Moreover, the integrated circuit may include a driver circuit of electrical signals for the optical source and/or a receiver circuit of electrical signals from the optical receiver. Furthermore, the optical integrated circuit may be positioned in a hole or an etch pit in a substrate, and an alignment feature may mechanically couple the substrate to an optical-fiber assembly, so that the optical-fiber assembly is positioned relative to the interposer and the optical integrated circuit. In particular, the optical-fiber assembly may partially overlap the interposer, so that optical signals are provided and/or received from the optical integrated circuit through the interposer.

    Abstract translation: 芯片封装包括集成电路和具有光源和/或光接收器的光集成电路（例如混合集成电路）。 集成电路和光学集成电路可以在芯片封装中的插入器的相对侧上彼此靠近。 此外，集成电路可以包括用于光源的电信号的驱动器电路和/或来自光接收器的电信号的接收器电路。 此外，光学集成电路可以位于衬底中的孔或蚀刻坑中，并且对准特征可以将衬底机械地耦合到光纤组件，使得光纤组件相对于插入件定位，并且 光集成电路。 特别地，光纤组件可以部分地与插入件重叠，使得通过插入器提供和/或从光学集成电路接收光信号。

    Dual-use laser source comprising a cascaded array of hybrid distributed feedback lasers
    5.
    发明授权
    Dual-use laser source comprising a cascaded array of hybrid distributed feedback lasers 有权

    公开(公告)号：US10170888B2

    公开(公告)日：2019-01-01

    申请号：US15343080

    申请日：2016-11-03

    Applicant: Oracle International Corporation

    Inventor： Xuezhe Zheng ,  Ying Luo ,  Ashok V. Krishnamoorthy ,  Kannan Raj

    IPC: H01S5/12 ,  G02F1/025 ,  H04J14/02 ,  H01S5/40 ,  H01S5/125 ,  H04B10/50

    Abstract: The disclosed embodiments provide a laser source comprising a silicon waveguide formed in a silicon layer, and a cascaded array of hybrid distributed feedback (DFB) lasers formed by locating sections of III-V gain material over the silicon waveguide. Each DFB laser in the cascaded array comprises a section of III-V gain material located over the silicon waveguide, wherein the section of III-V gain material includes an active region that generates light, and a Bragg grating located between the III-V gain material and the silicon waveguide. This Bragg grating has a resonance frequency within a gain bandwidth of the section of III-V material and is transparent to frequencies that differ from the resonance frequency. Moreover, each DFB laser has a hybrid mode that resides partially in the III-V gain material and partially in silicon.

    Integrated chip package with optical interface
    6.
    发明授权
    Integrated chip package with optical interface 有权

    公开(公告)号：US09671572B2

    公开(公告)日：2017-06-06

    申请号：US14492816

    申请日：2014-09-22

    Applicant: Oracle International Corporation

    Inventor： Patrick J. Decker ,  Kannan Raj ,  Alan T. Hilton-Nickel

    IPC: G02B6/12 ,  G02B6/42

    CPC classification number: G02B6/4204 ,  G02B6/423 ,  G02B6/4269 ,  G02B6/428

    Abstract: A chip package includes an integrated circuit and an optical integrated circuit (such as a hybrid integrated circuit) with an optical source and/or an optical receiver. The integrated circuit and the optical integrated circuit may be proximate to each other on opposite sides of an interposer in the chip package. Moreover, the integrated circuit may include a driver circuit of electrical signals for the optical source and/or a receiver circuit of electrical signals from the optical receiver. Furthermore, the optical integrated circuit may be positioned in a hole or an etch pit in a substrate, and an alignment feature may mechanically couple the substrate to an optical-fiber assembly, so that the optical-fiber assembly is positioned relative to the interposer and the optical integrated circuit. In particular, the optical-fiber assembly may partially overlap the interposer, so that optical signals are provided and/or received from the optical integrated circuit through the interposer.

    System and method for use of virtual or augmented reality with data center operations or cloud infrastructure
    9.
    发明授权
    System and method for use of virtual or augmented reality with data center operations or cloud infrastructure 有权

    公开(公告)号：US11611484B2

    公开(公告)日：2023-03-21

    申请号：US17071830

    申请日：2020-10-15

    Applicant: ORACLE INTERNATIONAL CORPORATION

    Inventor： Amarpal Monga ,  Alex Hamilton ,  Iliya Roitburg ,  Edward Wallace ,  Kannan Raj ,  Wentao Deng ,  Brian Ho ,  Giuliano Pennesi

    IPC: H04L41/22 ,  H04L41/12 ,  G06T19/00 ,  H04L67/131 ,  G06V10/80

    Abstract: In accordance with an embodiment, described herein is a system and method for use of virtual reality and/or augmented reality with data center operations and cloud infrastructure services. The approach leverages virtual reality and/or augmented reality, and insights from various sources of data describing the operation of the data center, including data center analytics, for facilitating in-situ diagnostics, operations, monitoring, maintenance, repair, health prognostics, and remote collaboration, toward enhancing the efficiency of managing and running data centers. In accordance with an embodiment, the system can operate with VR/AR devices that can be provided as VR/AR headsets or other devices, that include sensors that measure a data center operator's position, orientation, and movement within a cloud infrastructure or data center environment, and can display a visualization associated with the physical devices of the data center environment, including where appropriate information from other sources useful in performing data center operations.

    SYSTEM AND METHOD FOR USE OF VIRTUAL OR AUGMENTED REALITY WITH DATA CENTER OPERATIONS OR CLOUD INFRASTRUCTURE
    10.
    发明申请
    SYSTEM AND METHOD FOR USE OF VIRTUAL OR AUGMENTED REALITY WITH DATA CENTER OPERATIONS OR CLOUD INFRASTRUCTURE 有权

    公开(公告)号：US20210112145A1

    公开(公告)日：2021-04-15

    申请号：US17071830

    申请日：2020-10-15

    Applicant: ORACLE INTERNATIONAL CORPORATION

    Inventor： Amarpal Monga ,  Alex Hamilton ,  Iliya Roitburg ,  Edward Wallace ,  Kannan Raj ,  Wentao Deng ,  Brian Ho ,  Giuliano Pennesi

    IPC: H04L29/06 ,  G06T19/00

    Abstract: In accordance with an embodiment, described herein is a system and method for use of virtual reality and/or augmented reality with data center operations and cloud infrastructure services. The approach leverages virtual reality and/or augmented reality, and insights from various sources of data describing the operation of the data center, including data center analytics, for facilitating in-situ diagnostics, operations, monitoring, maintenance, repair, health prognostics, and remote collaboration, toward enhancing the efficiency of managing and running data centers. In accordance with an embodiment, the system can operate with VR/AR devices that can be provided as VR/AR headsets or other devices, that include sensors that measure a data center operator's position, orientation, and movement within a cloud infrastructure or data center environment, and can display a visualization associated with the physical devices of the data center environment, including where appropriate information from other sources useful in performing data center operations.

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