公开(公告)号：DE60010025D1

公开(公告)日：2004-05-27

申请号：DE60010025

申请日：2000-12-18

Applicant: PACE MICRO TECHNOLOGY PLC SALT

Inventor： BRISTOW ANTHONY ,  CROSS STEPHEN ,  WOODHOUSE DAVID ,  FULLER COLIN ,  STURGE DAVID

IPC: H01L23/367 ,  H05K7/20

Abstract: The invention relates to the provision of a cooling effect on components (6) of electrical apparatus which are mounted on an upper surface (8) of a printed circuit board (4) within a housing (2). The invention provides for the mounting of a material layer (12) which can absorb or otherwise dissipate heat and the invention allows the mounting of the said material (12) beneath the printed circuit board (4) within the housing (2) in position to provide improved cooling effect without contacting the components (6) themselves.

公开(公告)号：DE60010025T2

公开(公告)日：2005-03-31

申请号：DE60010025

申请日：2000-12-18

Applicant: PACE MICRO TECHNOLOGY PLC SALT

Inventor： BRISTOW ANTHONY ,  CROSS STEPHEN ,  WOODHOUSE DAVID ,  FULLER COLIN ,  STURGE DAVID

IPC: H01L23/367 ,  H05K7/20

Abstract: The invention relates to the provision of a cooling effect on components (6) of electrical apparatus which are mounted on an upper surface (8) of a printed circuit board (4) within a housing (2). The invention provides for the mounting of a material layer (12) which can absorb or otherwise dissipate heat and the invention allows the mounting of the said material (12) beneath the printed circuit board (4) within the housing (2) in position to provide improved cooling effect without contacting the components (6) themselves.