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    Micro assembler with fine angle control
    1.
    发明授权
    Micro assembler with fine angle control 有权

    公开(公告)号：US12051610B2

    公开(公告)日：2024-07-30

    申请号：US18126520

    申请日：2023-03-27

    Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

    Inventor： JengPing Lu ,  Eugene M. Chow ,  David K. Biegelsen

    IPC: H01L21/68 ,  H01L21/683

    CPC classification number: H01L21/68 ,  H01L21/6831 ,  H01L21/6833

    Abstract: First and second chiplets are positioned along a surface to respectively cover first and second electrodes. The first electrode is activated to cause an attraction force between the first electrode and the first chiplet. The second electrode is deactivated allowing the second chiplet to rotate on the surface. While the first electrode is activated and the second electrode is deactivated, a rotation field is applied to cause the second chiplet to be oriented at a desired orientation angle, the first chiplet being prevented from rotating by the attraction force.

    CHIPLET LOADER FOR MICROASSEMBLER
    2.
    发明公开
    CHIPLET LOADER FOR MICROASSEMBLER 审中-公开

    公开(公告)号：US20240242993A1

    公开(公告)日：2024-07-18

    申请号：US18097543

    申请日：2023-01-17

    Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

    Inventor： JengPing Lu ,  David K. Biegelsen ,  Sourobh Raychaudhuri ,  Bradley Rupp ,  Eugene M. Chow

    IPC: H01L21/677

    CPC classification number: H01L21/67721 ,  H01L21/67736

    Abstract: A micro-assembly system includes a reservoir that stores a supply of chiplets suspended in a suspension fluid. Each of the chiplets has a bottom major surface that defines a right side down orientation. The system includes a delivery surface or belt that delivers the chiplets from the reservoir to an assembly surface. The system includes a micro assembler that may arrange the first subset of the chiplets in a pattern on the assembly surface. The micro assembler moves the first subset of chiplets towards a subsequent assembly stage. The micro assembler has an array of field generators fixed relative to the assembly surface that move the first subset of the chiplets along the assembly surface in response to signals applied to each of the field generators.

    METHOD AND SYSTEM FOR MASS ASSEMBLY OF THIN-FILM MATERIALS
    3.
    发明申请
    METHOD AND SYSTEM FOR MASS ASSEMBLY OF THIN-FILM MATERIALS 有权

    公开(公告)号：US20220388295A1

    公开(公告)日：2022-12-08

    申请号：US17889514

    申请日：2022-08-17

    Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

    Inventor： JengPing Lu ,  Eugene M. Chow ,  Sourobh Raychaudhuri

    IPC: B32B37/00 ,  B32B37/10 ,  B32B38/04 ,  B32B38/18

    Abstract: A system includes a separation tool that separates a carrier wafer to form a plurality of chiplet carriers. The carrier wafer having sheets of thin film material attached. A sensor and processor of the system determine an orientation of the portions of the sheets of thin film material relative to the chiplets to determine a mapping therebetween. A fluid carrier of the system places the chiplet carriers on an assembly surface in a disordered pattern. The system includes a micro assembler that arranges the chiplet carriers from the disordered pattern to a predetermined pattern based on the mapping. A carrier of the system transfers the portions of the thin film material from the chiplet carriers to a target substrate.

    Transfer substrate utilizing selectable surface adhesion transfer elements
    4.
    发明授权
    Transfer substrate utilizing selectable surface adhesion transfer elements 有权

    公开(公告)号：US10964582B2

    公开(公告)日：2021-03-30

    申请号：US16449844

    申请日：2019-06-24

    Applicant: Palo Alto Research Center Incorporated

    Inventor： Yunda Wang ,  Sourobh Raychaudhuri ,  JengPing Lu

    IPC: H01L21/683 ,  B65G47/90 ,  H01L25/075 ,  H01L33/62

    Abstract: An apparatus includes a transfer substrate with two or more transfer elements. Each of the transfer elements includes an adhesion element having a first surface adhesion at a first temperature and a second surface adhesion at a second temperature. The second surface adhesion less than the first surface adhesion. Each transfer element has a thermal element operable to change a temperature of the adhesion element in response to an input. A controller is coupled to provide the inputs to the thermal elements of the two or more transfer elements to cause a subset of the transfer elements to selectably hold objects to and release the objects from the transfer substrate in response to changes between the first and second surface adhesion of the subset of the transfer elements.

    Capacitive imaging device with active pixels and method
    5.
    发明授权
    Capacitive imaging device with active pixels and method 有权

    公开(公告)号：US10101373B2

    公开(公告)日：2018-10-16

    申请号：US14257566

    申请日：2014-04-21

    Applicant: Palo Alto Research Center Incorporated

    Inventor： JengPing Lu

    IPC: G01R27/26 ,  G06F3/044 ,  G06K9/00 ,  G06F3/041

    Abstract: A capacitive image sensor includes a sensor array having capacitive image pixels. Each pixel has a two-transistor configuration including a pixel selection transistor and a source follower transistor. The pixel selection transistor activates the source follower transistor. The source follower is coupled to a variable capacitance that affects an input impedance of the source follower. An AC current is source is used to interrogate the activated source follower to determine an output impedance of the source follower. The output impedance is a function of the input impedance and the output impedance is representative of the nearness of an object.

    TAG SYSTEM IMPLEMENTING A NORMAL-ON ANTENNA AND METHODS OF USE
    9.
    发明申请
    TAG SYSTEM IMPLEMENTING A NORMAL-ON ANTENNA AND METHODS OF USE 审中-公开

    公开(公告)号：US20200342280A1

    公开(公告)日：2020-10-29

    申请号：US16391456

    申请日：2019-04-23

    Applicant: Palo Alto Research Center Incorporated

    Inventor： Ping Mei ,  JengPing Lu ,  Kent Evans ,  Janos Veres

    IPC: G06K19/073 ,  G06K7/10 ,  G06Q10/08 ,  G06K19/07 ,  G06K19/077

    Abstract: Systems and methods for operating a tag system. The methods comprising: wirelessly communicating, from a tag, a first signal at a first frequency spectrum that allows a tag reader to detect the first signal, when the tag is not proximate to an antenna modulation marker or when the antenna modulation marker has a first orientation relative to the tag; and performing operations by the tag to wirelessly communicate a second signal at a second frequency spectrum that does not allow the tag reader to detect the first signal, when the tag is proximate to the antenna modulation marker or when the antenna modulation marker has a second different orientation relative to the tag.

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