公开(公告)号：DE602005025376D1

公开(公告)日：2011-01-27

申请号：DE602005025376

申请日：2005-07-26

Applicant: PANASONIC CORP

Inventor： UEMOTO TAKAARI ,  NATO HIROYUKI

IPC: H01L33/62 ,  F21K99/00 ,  F21V19/00 ,  F21Y101/02 ,  H01L25/075 ,  H01L33/48

公开(公告)号：AT492036T

公开(公告)日：2011-01-15

申请号：AT05767814

申请日：2005-07-26

Applicant: PANASONIC CORP

Inventor： UEMOTO TAKAARI ,  NATO HIROYUKI

IPC: H01L33/62 ,  F21K99/00 ,  F21V19/00 ,  F21Y101/02 ,  H01L25/075 ,  H01L33/48

Abstract: Provided is a light source that has high reliability and hardly causes conductivity failure between a light emitting device and a conductive land. In an LED light source of the present invention, an LED bare chip is mounted to conductive lands of a substrate, using bumps (55a, 55b). The LED bare chip (D65) is provided with a p-electrode (Lp) and an n-electrode (Ln) on a rear surface. The p-electrode (Lp) is larger in area than the n-electrode (Ln). The p-electrode (Lp) is bonded to a corresponding conductive land via four bumps (55a), whereas the n-electrode (Ln) is bonded to a corresponding conductive land via one bump (55b). A bonded area (Sn) between the n-electrode (Ln) and the bump (55b) is larger than a bonded area (Sp) between the p-electrode (Lp) and one of the bumps (55a).

公开(公告)号：EP2735786A4

公开(公告)日：2015-03-11

申请号：EP12817385

申请日：2012-02-03

Applicant: PANASONIC CORP

Inventor： MATSUDA TSUGIHIRO ,  TAKEUCHI NOBUYOSHI ,  KAKUNO YOSHINORI ,  MIKI MASAHIRO ,  NAGAI HIDEO ,  UEMOTO TAKAARI

IPC: F21S2/00 ,  F21K99/00 ,  F21Y101/02

CPC classification number: F21K9/1355 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21K9/90 ,  F21V19/003 ,  F21V23/006 ,  F21V29/15 ,  F21V29/507 ,  F21Y2115/10

公开(公告)号：EP2667085A4

公开(公告)日：2014-07-30

申请号：EP11856280

申请日：2011-10-26

Applicant: PANASONIC CORP

Inventor： MATSUDA TSUGIHIRO ,  MIKI MASAHIRO ,  UEMOTO TAKAARI ,  NAGAI HIDEO

IPC: F21K99/00 ,  F21V29/00 ,  F21Y101/02

CPC classification number: F21V3/00 ,  F21K9/232 ,  F21S8/04 ,  F21V3/0418 ,  F21V29/004 ,  F21V29/506 ,  F21V29/70 ,  F21Y2107/60 ,  F21Y2115/10 ,  Y02B20/30

Abstract: A light bulb shaped lamp (1) according to the present invention includes: a hollow globe (2) having an opening; a plurality of light-emitting modules (3) housed in the globe (2), each of the light-emitting modules (3) having a semiconductor light-emitting device that is a light source; and a stem (5) extending from the opening of the globe (2) to an inside of the globe (2), the stem (5) supporting the light-emitting modules (3), in which the stem (5) penetrates at least one of the light-emitting modules (3), and the light-emitting modules (3) are spaced a predetermined distance apart along an axis of the stem (5).

Abstract translation: 根据本发明的灯泡状灯（1）包括：具有开口的中空球体（2） 每个发光模块（3）具有作为光源的半导体发光器件;多个发光模块（3），其容纳在所述球体（2）中; 以及从所述球体（2）的开口延伸到所述球体（2）的内部的杆（5），所述杆（5）支撑所述发射模块（3），所述杆（5）穿过所述发射模块 至少一个发光模块（3）和发光模块（3）沿着杆（5）的轴线隔开预定距离。

公开(公告)号：EP2442009A4

公开(公告)日：2013-03-20

申请号：EP11783191

申请日：2011-03-18

Applicant: PANASONIC CORP

Inventor： UEMOTO TAKAARI ,  MIKI MASAHIRO ,  UEDA YASUYUKI

IPC: F21S2/00 ,  F21V7/00 ,  F21V7/04 ,  F21V7/22 ,  F21Y101/02

CPC classification number: F21V3/00 ,  F21K9/232 ,  F21K9/60 ,  F21V3/0418 ,  F21V3/0436 ,  F21V7/0008 ,  F21Y2115/10

Abstract: Provided is a bulb-type LED lamp 10 configured to diffuse light outward through a globe. The bulb-type LED lamp 10 includes LED modules 22, 24, 28, 30, each having a mounting substrate and LEDs mounted on the mounting substrate, and a base 14 through which power is supplied to the LEDs for light emission. The LED lamp 10 also includes a light diffusing member 58. Among the LED modules 22, 24, 28, 30, the LED module 22 is positioned on an imaginary extension of a central axis X of the base 14, and the light diffusing member 58 is positioned inside the globe 16 to receive light emitted from the LED module 22. The other LED modules 22, 28, 30 are positioned in a vicinity of the LED module 22, tilted to face the light diffusing member 58.

公开(公告)号：EP2743562A4

公开(公告)日：2014-07-02

申请号：EP12824182

申请日：2012-02-15

Applicant: PANASONIC CORP

Inventor： SHIDA SATOSHI ,  TAKAHASHI KENJI ,  SHUTO MITSUKO ,  MIKI MASAHIRO ,  NAGAI HIDEO ,  UEMOTO TAKAARI

IPC: F21V29/00 ,  F21K99/00 ,  F21V3/00 ,  F21V3/02 ,  F21V3/04 ,  F21V7/00 ,  F21V13/02 ,  F21V15/06 ,  F21V17/10 ,  F21V23/00 ,  F21Y101/02

CPC classification number: F21K9/23 ,  F21K9/60 ,  F21V3/02 ,  F21V3/0418 ,  F21V3/0436 ,  F21V7/0016 ,  F21V13/02 ,  F21V17/101 ,  F21V23/002 ,  F21V23/006 ,  F21V29/15 ,  F21V29/506 ,  F21V29/85 ,  F21Y2115/10

Abstract: An LED lamp has an envelope that includes a globe (30) and a case (50), an interior space of the envelope being divided in two by a mount (20) closing an opening of the globe (30), the lamp containing, in a globe (30) side of the interior space, an LED and, in a case (50) side of the interior space, a circuit unit for causing the LED to emit light. The LED is thermally connected to the mount (20), and the mount (20) and the case (50) are joined to the globe (30) such that, during light emission, at least as much heat from the LED is propagated from the mount (20) to the globe (30) as from the mount (20) to the case (50).

Abstract translation: LED灯具有包围球体（30）和外壳（50）的外壳，外壳的内部空间由闭合球体（30）的开口的安装件（20）分成两部分， 在内部空间的球形（30）侧，LED和在内部空间的壳体（50）侧，用于使LED发光的电路单元。 LED与基座（20）热连接，安装座（20）和壳体（50）与球体（30）接合，使得在发光期间，来自LED的至少一半的热量从 从座（20）到壳体（50）的安装件（20）到球体（30）。

公开(公告)号：EP2492978A4

公开(公告)日：2013-02-20

申请号：EP11832060

申请日：2011-09-06

Applicant: PANASONIC CORP

Inventor： MATSUDA TSUGIHIRO ,  TAKEUCHI NOBUYOSHI ,  NAGAI HIDEO ,  UEMOTO TAKAARI ,  MIKI MASAHIRO ,  MOTOYA ATSUSHI

IPC: H01L33/48 ,  F21S2/00 ,  F21Y101/02

CPC classification number: H01L33/486 ,  F21K9/232 ,  F21V3/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/507 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2924/00

公开(公告)号：EP2309168A4

公开(公告)日：2013-12-04

申请号：EP09794150

申请日：2009-06-30

Applicant: PANASONIC CORP

Inventor： SHIDA SATOSHI ,  UEMOTO TAKAARI

IPC: F21S2/00 ,  F21K99/00 ,  F21V3/02 ,  F21V3/04 ,  F21V23/00 ,  F21V29/00 ,  F21Y101/02

CPC classification number: F21V3/02 ,  F21K9/23 ,  F21K9/233 ,  F21V3/0418 ,  F21V3/0436 ,  F21V23/002 ,  F21V29/713 ,  F21V29/74 ,  F21V29/89 ,  F21Y2115/10

Abstract: To provide a bulb-type lighting source that employs a light-emitting element and has better heat dispersal characteristics than the conventional technology. A lamp 1 comprising a heat sink member 11, a mounting substrate 21 placed in surface contact with a surface of the heat sink member 11, a light-emitting unit 24 placed on a surface of the mounting substrate 21, a globe 41 covering the light-emitting unit 24 in light emission directions thereof, and a heat sink member 31 that has a first part in surface contact with a perimeter 28 of the surface of the mounting substrate 21 where the light-emitting unit 24 is not mounted and a second part in surface contact with the heat sink member 11.

公开(公告)号：EP2527719A4

公开(公告)日：2013-07-17

申请号：EP11786240

申请日：2011-02-10

Applicant: PANASONIC CORP

Inventor： MIKI MASAHIRO ,  UEMOTO TAKAARI ,  NAGAI HIDEO

IPC: F21S2/00 ,  F21K99/00 ,  F21V3/00 ,  F21V23/00 ,  F21V29/00 ,  F21Y101/02 ,  F21Y105/00

CPC classification number: F21V23/009 ,  F21K9/232 ,  F21K9/238 ,  F21V3/00 ,  F21V23/006 ,  F21V29/004 ,  F21V29/713 ,  F21V29/773 ,  F21V29/83 ,  F21V29/87 ,  F21Y2105/16 ,  F21Y2115/10

Abstract: A lamp capable of effectively suppressing increase in the temperature of circuit devices is provided. The lamp (10) includes: an LED module (4) composed of LED chips (4b); a base (2) through which electric power is received; a lighting circuit (7) which includes a circuit device group (71) for generating electric power for causing the LED module (4) to emit light using the electric power received through the base (2); an inner casing (6) which is a tubular portion made of resin for housing the lighting circuit (7); and an outer casing (3) which is a tubular portion for housing the inner casing (6). On the circumferential surface of the inner casing (6), a protrusion (65) is provided which directly abuts the inner circumferential surface of the outer casing (3).

公开(公告)号：EP2442624A4

公开(公告)日：2013-01-09

申请号：EP10785894

申请日：2010-05-21

Applicant: PANASONIC CORP

Inventor： SETOMOTO TATSUMI ,  NAGAI HIDEO ,  UEMOTO TAKAARI

IPC: H05B37/02 ,  H05B33/08

CPC classification number: H05B33/0827 ,  H05B33/0872 ,  Y02B20/19 ,  Y02B20/383

Abstract: Provided is a lighting device which can be dimmed and subjected to change in color temperature of the lighting color in accordance with a dimming level. To the lighting device, AC power under phase-controlled is supplied. The lighting device is provided with a light emitting elements array and a switching unit. The light emitting elements array includes a plurality of light emitting elements, which are two or more types of light emitting elements having different lighting colors. The switching unit switches an electrical connections between the light emitting elements included in the light emitting elements array so as to change the number of light emitting elements inserted in series to a power supply path and the proportion of numbers of light emitting elements per lighting color among the number of the inserted light emitting elements in accordance with a voltage supplied to the light emitting elements array.