公开(公告)号：US20230250281A1

公开(公告)日：2023-08-10

申请号：US18012176

申请日：2021-06-14

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Jun YASUMOTO ,  Rihoko WATANABE ,  Teppei WASHIO ,  Hiroharu INOUE

IPC: C08L79/08 ,  C08J5/24 ,  C08J7/04 ,  H05K1/03

CPC classification number: C08L79/08 ,  C08J5/246 ,  C08J7/0427 ,  H05K1/0353 ,  C08J2309/06 ,  C08J2333/08 ,  C08J2363/00 ,  C08J2379/08 ,  C08L2203/16 ,  C08L2205/035

Abstract: A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tanδ = E″/E′) of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof. The loss modulus (E″), the storage modulus (E′), and the loss tangent (tanδ = E″/E′) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.

公开(公告)号：US20250129245A1

公开(公告)日：2025-04-24

申请号：US18832582

申请日：2023-01-12

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masafumi HONMA ,  Ryuji TAKAHASHI ,  Teppei WASHIO ,  Yuichi ISHIKAWA ,  Hirofumi MIDORIKAWA

IPC: C08L63/00 ,  C08J5/24 ,  C08L39/04 ,  H05K1/03

Abstract: A resin composition contains: a curable resin (A); an acrylic-monomer copolymer (B) having a structure expressed by formulae (1) to (3) and having a weight average molecular weight equal to or greater than 10,000 and equal to or less than 900,000; an inorganic filler (C) where a molybdenum compound is present on at least a part of a surface thereof; and another inorganic filler (D) different from the inorganic filler (C). R1 is either a hydrogen atom or a methyl group. R2 includes at least one of a glycidyl group or an epoxidized alkyl group which is selected from the group consisting of a hydrogen atom, an alkyl group, the glycidyl group, and the epoxidized alkyl group. R3 is either a hydrogen atom or a methyl group. R4 is Ph (phenyl group), —COOCH2Ph, or —COO(CH2)2Ph.

公开(公告)号：US20230257581A1

公开(公告)日：2023-08-17

申请号：US18012161

申请日：2021-06-14

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Jun YASUMOTO ,  Rihoko WATANABE ,  Teppei WASHIO ,  Hiroharu INOUE

IPC: C08L79/08 ,  C08K5/521 ,  C08L25/08 ,  C08J5/24

CPC classification number: C08L79/085 ,  C08K5/521 ,  C08L25/08 ,  C08J5/24 ,  C08L2203/16 ,  C08L2203/20 ,  C08L2201/02

Abstract: A resin composition contains a maleimide compound (A) and a phosphorus-containing compound (B). The maleimide compound (A) includes a first maleimide compound (A1) having an alkyl group, of which a carbon number is equal to or greater than six, and/or an alkylene group, of which a carbon number is equal to or greater than six. The phosphorus-containing compound (B) includes a phosphorus-containing compound (B1) having a structure expressed by the following formula (b1), where s indicates an integer falling within a range from 1 to 10, Z indicates either an arylene group or an ester bond expressed by the following formula (b1.1), R1 to R3 each independently indicate either a hydrogen atom or a monovalent organic group, and * indicates a bond.