公开(公告)号：AU2009322495B2

公开(公告)日：2014-08-07

申请号：AU2009322495

申请日：2009-12-02

Applicant: PANDUIT CORP

Inventor： STRAKA FRANK M ,  TELLAS RONALD A ,  GERMAN JASON J ,  VAITKUS VYTAS J

IPC: H01R24/00

Abstract: This application describes a jack for improving crosstalk attenuation. The jack has a housing, a foil at least partially surrounding the housing, a printed circuit board, and at least one pair of insulation displacement contacts and vias. Each pair of insulation contacts and vias are associated with a differential signal. A conductive trace stub is routed on the printed circuit board near the edge of the board in order to at least partially balance the coupling from one of the insulation displacement contacts and vias of a pair to the foil with the other insulation displacement contact and via of the pair.

公开(公告)号：CA2745291C

公开(公告)日：2017-02-28

申请号：CA2745291

申请日：2009-12-02

Applicant: PANDUIT CORP

Inventor： STRAKA FRANK M ,  TELLAS RONALD L ,  GERMAN JASON J ,  VAITKUS VYTAS J

IPC: H01R24/00

Abstract: This application describes a jack for improving crosstalk attenuation. The jack has a housing, a foil at least partially surrounding the housing, a printed circuit board, and at least one pair of insulation displacement contacts and vias. Each pair of insulation contacts and vias are associated with a differential signal. A conductive trace stub is routed on the printed circuit board near the edge of the board in order to at least partially balance the coupling from one of the insulation displacement contacts and vias of a pair to the foil with the other insulation displacement contact and via of the pair.

公开(公告)号：AU2009322495A1

公开(公告)日：2010-06-10

申请号：AU2009322495

申请日：2009-12-02

Applicant: PANDUIT CORP

Inventor： STRAKA FRANK M ,  TELLAS RONALD A ,  GERMAN JASON J ,  VAITKUS VYTAS J

IPC: H01R24/00

Abstract: An RJ45 Communication jack has a housing with a top, bottom, front, and back. A foil is immediately adhered to and partially covers the housing. A top or bottom of the housing is covered by a first portion and a second portion of the foil wherein the first portion and the second portion are separated by a nonconductive gap. The gap extends from the front of the housing to the rear of the housing. With such foils placed on each one of a series of adjacent jack housing, common mode noise caused by capacitive coupling between adjacent ones of the foils is reduced.

公开(公告)号：HK1157074A1

公开(公告)日：2012-06-22

申请号：HK11111354

申请日：2011-10-20

Applicant: PANDUIT CORP

Inventor： STRAKA FRANK M ,  TELLAS RONALD L ,  GERMAN JASON J ,  VAITKUS VYTAS J

IPC: H01R20060101

公开(公告)号：MX2011005785A

公开(公告)日：2011-06-24

申请号：MX2011005785

申请日：2009-12-02

Applicant: PANDUIT CORP

Inventor： STRAKA FRANK M ,  TELLAS RONALD L ,  GERMAN JASON J ,  VAITKUS VYTAS J

IPC: H01R24/00

Abstract: Esta solicitud describe un enchufe para mejorar la atenuación de diafonía. -El enchufe tiene un alojamiento, una lámina que rodea al menos parcialmente el alojamiento, una tarjeta de circuito impreso, y al menos un par de contactos y vías de desplazamiento de aislamiento. Cada par de contactos y vías de aislamiento están asociados con una señal diferencial. Una conexión de segmento conductor se enruta en la tarjeta de circuito impreso cerca del borde de la tarjeta con el fin de balancear al menos parcialmente el acoplamiento desde uno de los contactos y las vías de desplazamiento de aislamiento de un par hacia la lámina con el otro contacto y vía de desplazamiento de aislamiento del par.

公开(公告)号：CA2745291A1

公开(公告)日：2010-06-10

申请号：CA2745291

申请日：2009-12-02

Applicant: PANDUIT CORP

Inventor： STRAKA FRANK M ,  TELLAS RONALD A ,  GERMAN JASON J ,  VAITKUS VYTAS J

IPC: H01R24/00

Abstract: This application describes a jack for improving crosstalk attenuation. The jack has a housing, a foil at least partially surrounding the housing, a printed circuit board, and at least one pair of insulation displacement contacts and vias. Each pair of insulation contacts and vias are associated with a differential signal. A conductive trace stub is routed on the printed circuit board near the edge of the board in order to at least partially balance the coupling from one of the insulation displacement contacts and vias of a pair to the foil with the other insulation displacement contact and via of the pair.