公开(公告)号：WO2013173210A3

公开(公告)日：2013-11-21

申请号：PCT/US2013/040717

申请日：2013-05-13

Applicant: PANDUIT CORP.

Inventor： FLEMING, James, N. ,  GOLDSBERRY, Timothy ,  SHURHAY, Mark ,  HIBNER, Max, W.

IPC: H05K7/20

Abstract: A thermal ducting system for electronic equipment in an electronic equipment enclosure is provided. The thermal ducting system includes a top duct, a bottom duct spaced apart from the top duct, a side duct extending from the top duct to the bottom duct and along an intake side of the electronic equipment, and at least one baffle positioned in the side duct.

公开(公告)号：EP2850925A2

公开(公告)日：2015-03-25

申请号：EP13727425.4

申请日：2013-05-13

Applicant: Panduit Corp.

Inventor： FLEMING, James, N. ,  GOLDSBERRY, Timothy ,  SHURHAY, Mark ,  HIBNER, Max, W.

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  B23P19/00 ,  H05K7/20736 ,  Y10T29/49826

Abstract: A thermal ducting system for electronic equipment in an electronic equipment enclosure is provided. The thermal ducting system includes a top duct, a bottom duct spaced apart from the top duct, a side duct extending from the top duct to the bottom duct and along an intake side of the electronic equipment, and at least one baffle positioned in the side duct.

公开(公告)号：EP2850925B1

公开(公告)日：2019-02-27

申请号：EP13727425.4

申请日：2013-05-13

Applicant: Panduit Corp.

Inventor： FLEMING, James, N. ,  GOLDSBERRY, Timothy ,  SHURHAY, Mark ,  HIBNER, Max, W.

IPC: B23P19/00 ,  H05K7/20