公开(公告)号：DE102004033292A1

公开(公告)日：2005-02-10

申请号：DE102004033292

申请日：2004-07-09

Applicant: PHILIPS INTELLECTUAL PROPERTY

Inventor： BRETSCHNEIDER ERNST

IPC: H03K3/011 ,  H03K3/012 ,  H03K3/0231 ,  H03K3/354

Abstract: Oscillator circuit (10) comprises two symmetrical branches (12,14) with common input (16). Each branch contains further input (18,20), output (22,24), capacitor(s) (C01,1) and its (dis)charge path (26,28,30,32). Each output is coupled to further input of opposite branch.Output of each branch is connected to common storage element (34). Charge current is controllable via further input, while discharge current is controllable via common input. Output voltage (CLK,CLK-n) is controllable at each output by capacitor voltage.

公开(公告)号：WO2005006437A8

公开(公告)日：2006-03-02

申请号：PCT/IB2004051117

申请日：2004-07-05

Applicant: PHILIPS INTELLECTUAL PROPERTY ,  KONINKL PHILIPS ELECTRONICS NV ,  BRETSCHNEIDER ERNST

Inventor： BRETSCHNEIDER ERNST

IPC: G06K19/073 ,  G06K19/077 ,  H01L23/58 ,  H01L29/06

CPC classification number: H01L23/57 ,  G06K19/073 ,  G06K19/07363 ,  G06K19/07745 ,  H01L29/0657 ,  H01L2924/0002 ,  H01L2924/00

Abstract: To provide a security-sensitive semiconductor product, particularly a smart­card chip, in which are produced not only electrically active structures (2, 3, 4, 5, 6) envisaged by the chip design in the form of circuit functions in and on a wafer (1), which may for example be composed of silicon, but also additional, electrically conductive parts (42, 61, 62) (tiles) of the filling structure, which are insulated from one another, are generated by means of a design program in the remaining residual areas, which greatly impedes, to the reverse engineer the analysis of the security-sensitive circuit structure situated beneath them. The contacts between the parts which are generated, which contacts are for interlinking the latter with the chance signal paths described, may be set "by hand" or by a combination of the design programs in question and a corresponding routing program. The filling conductive parts can also be connected to circuit components, such as transistors, diodes, resistors or capacitors, in order to provide additional circuit functions (e.g. analyzer circuits).

Abstract translation: 为了提供安全敏感的半导体产品，特别是智能卡芯片，其不仅产生以晶片形式设计的电活性结构（2,3,4,5,6），其中晶片设计以晶片中和晶片上的电路功能的形式 （1），其可以例如由硅组成，但是通过设计程序产生填充结构彼此绝缘的附加的导电部件（42,46,62）（瓷砖） 在其他残留的区域中，极大地阻碍了对其下面的安全敏感电路结构的反向工程分析。 生成的部件之间的触点，用于将后者与所描述的机会信号路径相互联系的触点可以“手动”设置，或通过所讨论的设计程序和对应的路由程序的组合来设置。 填充导电部件还可以连接到电路部件，例如晶体管，二极管，电阻器或电容器，以便提供额外的电路功能（例如分析器电路）。