公开(公告)号：DE602008004165D1

公开(公告)日：2011-02-03

申请号：DE602008004165

申请日：2008-07-28

Applicant: PHILIPS INTELLECTUAL PROPERTY

Inventor： HOLTSLAG ANTONIUS H ,  VAN LOENEN EVERT J ,  SAUERLAENDER GEORG S ,  RADERMACHER HARALD J ,  VAN HUGTEN MARCEL F

IPC: E04F15/00

公开(公告)号：WO2009019625A2

公开(公告)日：2009-02-12

申请号：PCT/IB2008053018

申请日：2008-07-28

Applicant: KONINKL PHILIPS ELECTRONICS NV ,  PHILIPS INTELLECTUAL PROPERTY ,  HOLTSLAG ANTONIUS H M ,  VAN LOENEN EVERT J ,  SAUERLAENDER GEORG S ,  RADERMACHER HARALD J G ,  VAN HUGTEN MARCEL F A

Inventor： HOLTSLAG ANTONIUS H M ,  VAN LOENEN EVERT J ,  SAUERLAENDER GEORG S ,  RADERMACHER HARALD J G ,  VAN HUGTEN MARCEL F A

IPC: E04F15/00

CPC classification number: E04F15/00 ,  B29C43/28 ,  B29C66/435 ,  B29C66/472 ,  B29C2793/0027 ,  B29D99/0057 ,  B29L2031/108 ,  B29L2031/3017 ,  B29L2031/732 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T156/1075 ,  Y10T156/1085

Abstract: A method for manufacturing a flooring product with integrated circuitry, comprising the steps of providing a plurality of pieces (6), stacking said pieces on top of each other, displaced in relation to each other to form an offset stack (10), and compressing said offset stack to form said flooring product. The method further comprises arranging flexible circuitry (7) on an upper surface of at least one piece, so that, when said pieces are stacked, a first portion (7a) of flexible circuitry on the at least one piece is exposed, said first portion (7a) including circuitry for interacting with the environment. By arranging the circuitry in the flooring during such a manufacturing process, a flooring product is achieved where only a portion of the circuitry is exposed, and another portion is embedded in the flooring. This allows for exposing those parts of the circuitry that are adapted to interact with the surrounding environment, such as optical components, pressure sensitive components, acoustic components, etc.

Abstract translation: 一种用于制造具有集成电路的地板产品的方法，包括以下步骤：提供多个片段（6），将彼此叠置的所述片材相互叠置以形成偏移叠层（10），并压缩 所述偏移堆叠形成所述地板产品。 该方法还包括将柔性电路（7）布置在至少一件的上表面上，使得当所述片堆叠时，至少一件上的柔性电路的第一部分（7a）被暴露，所述第一部分 （7a）包括用于与环境相互作用的电路。 通过在这样的制造过程中将电路布置在地板中，实现地板产品，其中只有一部分电路被暴露，而另一部分被嵌入在地板中。 这允许暴露适于与周围环境相互作用的电路的那些部分，例如光学部件，压敏部件，声学部件等。