METHOD FOR REMOVING AT LEAST ONE INORGANIC LAYER FROM A COMPONENT
    1.
    发明申请
    METHOD FOR REMOVING AT LEAST ONE INORGANIC LAYER FROM A COMPONENT 审中-公开
    方法对元件进行去除至少一个无机层

    公开(公告)号:WO2005117507A2

    公开(公告)日:2005-12-08

    申请号:PCT/EP2005005792

    申请日:2005-05-30

    CPC classification number: H05H1/34 H05H2001/3468

    Abstract: The invention relates to a method for removing at least one inorganic layer from a component, whereby a plasma jet is produced in a working gas containing a reactive gas by means of an atmospheric discharge, the plasma jet is oriented towards the inorganic layer, the inorganic layer is at least partially melted by means of the plasma jet, and the at least partially melted inorganic layer is removed from the surface by the gas flow of the plasma jet. The inventive method can be used especially for delayering adhesive surfaces of two components, and for machining headlight components. The invention also relates to a device for producing a plasma jet for carrying out the inventive method.

    Abstract translation: 本发明涉及一种部件的至少一个无机层的方法除去,其中与包含在反应气体中的大气排出工作气体的等离子流,其中,所述等离子流被引导到无机层的帮助下形成,其中,所述无机层 由等离子体射流至少部分熔化,并且其中所述至少部分熔化的无机层是通过从表面的等离子束的气体流中去除。 此方法可用于特别是在两个部件的粘合面的剥离和编辑前照灯组件。 本发明还涉及一种设备,用于产生用于执行上述方法的等离子体射流。

    METHOD AND DEVICE FOR PRODUCING LOW-PRESSURE PLASMA AND THE USE THEREOF
    2.
    发明申请
    METHOD AND DEVICE FOR PRODUCING LOW-PRESSURE PLASMA AND THE USE THEREOF 审中-公开
    方法和设备,用于产生低压等离子体及低压等离子体中的应用

    公开(公告)号:WO2005099320A3

    公开(公告)日:2006-04-27

    申请号:PCT/EP2005003442

    申请日:2005-04-01

    CPC classification number: H01J37/32357 H01J37/32816 H05H1/42

    Abstract: The invention relates to a method for producing a low-pressure plasma consisting in generating a negative pressure in a low-pressure chamber by means of a vacuum pump and in leading a plasma beam at a high pressure to said low- pressure chamber. Said invention also relates to different use a low-pressure plasma for treating surfaces, surface coatings or gases. A device for producing a low-pressure plasma is also disclosed.

    Abstract translation: 本发明涉及一种方法,用于生成低压等离子体,其中通过其在更高的压力的等离子流被引入到低压室的低压室,并在真空泵产生的负压。 本发明还涉及低压等离子体以Oberflächenvorbehandeln的各种应用中,用于表面涂层或为气体的处理。 本发明还涉及一种设备,用于生成低压等离子体。

    8.
    发明专利
    未知

    公开(公告)号:DE102004033728A1

    公开(公告)日:2006-02-09

    申请号:DE102004033728

    申请日:2004-07-13

    Abstract: A method for treating a bond area of a workpiece, and a method for adhesively bonding workpieces are disclosed. The method for treating a bond area of a workpiece includes cleaning the bond area, activating the bond area, coating at least a portion of the bond area with an adhesion promoter, and chemically transforming the adhesion promoter with an aftertreatment. The method for adhesively bonding workpieces includes cleaning a bond area of a first workpiece, activating the bond area, coating at least a portion of the bond area with an adhesion promoter, chemically transforming the adhesion promoter with an aftertreatment, applying an adhesive to the bond area, bringing the other workpiece into contact with the first workpiece, and curing the adhesive.

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