1.
    发明专利
    未知

    公开(公告)号:DE112004000058T5

    公开(公告)日:2005-09-01

    申请号:DE112004000058

    申请日:2004-08-20

    Abstract: Provided are a porous organosilicate polymer composite prepared by heating an organic/inorganic hybrid polymer in which an organosilicate polymer is chemically bonded to a radial pore-forming polymer ended with a hydrolyzable alkoxysilyl group and used as a core molecule, and a semiconductor device using an organosilicate polymer composite film including the porous organosilicate polymer composite. The organosilicate polymer composite film has a very low dielectric constant, and thus, is useful as a dielectric film of the semiconductor device.

    2.
    发明专利
    未知

    公开(公告)号:DE112004001135T5

    公开(公告)日:2006-05-24

    申请号:DE112004001135

    申请日:2004-02-17

    Abstract: A star-shaped polymer having an alkoxy silane end group and containing an ether group at the center thereof, which is represented by formula (I), is useful as a pore introducer to obtain a low dielectric silicate polymer film having nano-pores distributed regularly and evenly. The star-shaped polymer is prepared by comprising conducting a ring open polymerization of a cyclic monomer and a polyhydric alcohol, and reacting the resulting polymer with an alkoxy silane compound.

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