SYSTEM FOR SUPPLYING CARBON DIOXIDE
    2.
    发明申请
    SYSTEM FOR SUPPLYING CARBON DIOXIDE 审中-公开
    供应二氧化碳的系统

    公开(公告)号:WO2006125062A3

    公开(公告)日:2007-02-22

    申请号:PCT/US2006019197

    申请日:2006-05-17

    CPC classification number: B08B7/0021 F25D3/10

    Abstract: A system and apparatus for the delivery of a high purity carbon dioxide fluid is provided. The system includes at least two separate semiconductor applications (6, 14), wherein one of said applications requires refrigeration. A first portion of the carbon dioxide stream is drawn off the supply line (1) and directing it to a first semiconductor application (6). A second portion is drawn off the supply line (1) and routed to a second semiconductor application (14) across a pressure-reduction device (12) thereby reducing the temperature and pressure of the second gas, entering the second semiconductor application.

    Abstract translation: 提供了用于输送高纯度二氧化碳流体的系统和装置。 该系统包括至少两个单独的半导体应用(6,14),其中所述应用之一需要制冷。 二氧化碳流的第一部分从供应管线(1)中排出并将其引导到第一半导体应用(6)。 第二部分从供应管线(1)中排出并且穿过减压装置(12)被引导到第二半导体应用(14)​​,从而降低进入第二半导体应用的第二气体的温度和压力。

    METHOD AND APPARATUS FOR PRETREATMENT OF POLYMERIC MATERIALS
    3.
    发明申请
    METHOD AND APPARATUS FOR PRETREATMENT OF POLYMERIC MATERIALS 审中-公开
    预处理聚合物材料的方法和设备

    公开(公告)号:WO2006012172A3

    公开(公告)日:2006-10-26

    申请号:PCT/US2005022169

    申请日:2005-06-23

    Abstract: The present invention relates to a method and apparatus for pretreating a polymeric material in a treatment chamber (12). The method includes providing a polymeric material component into the treatment chamber (12) and introducing a carbon dioxide fluid in supercritical state therein. The component is exposed to the carbon dioxide fluid to extract non-volatile organic residue contained in the component. The contaminated carbon dioxide fluid containing the extracted non-volatile organic residue is removed from the treatment chamber such that the organic residue does not deposit onto the polymeric material component by depressurizing the treatment chamber. Thereafter, the component is removed from the treatment chamber (12).

    Abstract translation: 本发明涉及用于在处理室(12)中预处理聚合物材料的方法和装置。 该方法包括将聚合物材料组分提供到处理室(12)中并将超临界状态的二氧化碳流体引入其中。 该组分暴露于二氧化碳流体中以提取组分中含有的不挥发性有机残留物。 含有提取的非挥发性有机残余物的污染的二氧化碳流体从处理室中去除,使得有机残余物不会通过减压处理室而沉积到聚合物材料组分上。 此后,从处理室(12)中取出部件。

    7.
    发明专利
    未知

    公开(公告)号:BR9603543A

    公开(公告)日:1998-05-12

    申请号:BR9603543

    申请日:1996-08-23

    Abstract: A system provides an oxygen-bearing gas and a gaseous reactant stream to a fluidized bed reactor. A sparger causes an entraining of the oxygen bearing gas into the reactant gas stream. A feed line couples the sparger to the reactor's fluidized bed and introduces the reactant gas stream and entrained oxygen-bearing gas directly into contact with the fluidized bed. A controller controls both the amount of oxygen-bearing gas and the gaseous reactant so that, at the point of feed injection, the fluidized bed catalyst does not experience an oxygen deficiency. To assure safety, the reactant content of the combined feed and oxygen stream is maintained above an upper flammability limit, preferably with a safety margin of at least 25%. In one embodiment, the system enables the production of acrylonitriles from a feed stream comprising ammonia, propylene and oxygen.

    8.
    发明专利
    未知

    公开(公告)号:BR9502933A

    公开(公告)日:1996-01-23

    申请号:BR9502933

    申请日:1995-06-26

    Abstract: A cooling system includes a unit (10) for processing product to be cooled or frozen. A secondary refrigeration loop (16) is connected to this unit (10) and introduces a refrigerant at or near atmospheric pressure into the unit. The secondary refrigeration loop (16) may be open or closed. The secondary loop (16) includes a secondary heat exchanger (20) for cooling the refrigerant. A primary, closed refrigeration loop (24), operating at a pressure of not less than 2 atmospheres, includes a forward flow path which comprises a primary refrigerant compressor (36,38) for producing compressed primary refrigerant, a primary heat exchanger (30) for receiving and cooling the compressed primary refrigerant and an expander (42) for further cooling and transferring the compressed refrigerant to the secondary heat exchanger (20) to enable cooling of the secondary refrigerant. The primary loop (24) further includes a return flow path from the secondary heat exchanger (30) to the primary refrigerant compressor (36,38) and to the primary heat exchanger (30). The primary heat exchanger (30) thereby provides heat exchange from the return flow path to the forward flow path to accomplish a cooling action.

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