公开(公告)号：JPH11138278A

公开(公告)日：1999-05-25

申请号：JP32047397

申请日：1997-11-06

Applicant: PSL KK

Inventor： OKADA SHUNICHI

IPC: G01J1/28 ,  B23K26/00 ,  B23K26/064 ,  B23K31/00 ,  G01J5/08 ,  G01J5/58 ,  G02B7/198 ,  H01S3/101 ,  H04N5/335 ,  H04N5/369 ,  H04N5/372 ,  B23K26/06

Abstract: PROBLEM TO BE SOLVED: To obtain a laser beam machine having a laser machining defect discriminating mechanism which discriminates a fine machining defect at a real time. SOLUTION: A machining laser emitting mechanism 7 constitutes the internal part of an emitting unit 6 of a laser beam machine 1, a third condensing body 15 is arranged on an optical path of laser beams emitted from a laser beam oscillator 3 in a machine main body 2, and the laser beams which become parallel light beams by transmitting the third condensing body are reflected by a bender mirror 8 wherein a dielectric block reflecting film, through which machining beams generating when an object to be machined is machined by laser beams can transmit, is provided. Moreover, a first condensing body 9 is arranged on the optical path of laser beams reflected by the mirror 8, a second condensing body 10 is arranged on the optical path after machining beams transmit the bender mirror, a first and second optical sensor 11, 12 as a light beam receiving member are arranged in the vicinity of a focal surface of the second condensing body, and respective optical sensors are electrically connected to a quality judging device 17 for machined states. The first, second and third condensing bodies, the bender mirror, the first and second optical sensors are provided within a casing body 13.