公开(公告)号：US20030122256A1

公开(公告)日：2003-07-03

申请号：US10364431

申请日：2003-02-10

Applicant: Phoenix Precision Technology Corp.

Inventor： Shih-Ping Hsu ,  Chiang-Du Chen ,  Yen-Hung Liu

IPC: H01L023/48

CPC classification number: H01L23/49811 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K3/243 ,  H05K2203/0542 ,  H05K2203/0577 ,  H05K2203/1476 ,  H01L2924/00

Abstract: The present invention discloses a substrate within a Ni/Au structure electroplated on electrical contact pads and a method for fabricating the same. The method comprises: providing a substrate with a circuit layout pattern and forming a conducting film on the surface of the substrate; depositing a first photoresist layer within an opening on said electrical conducting film surface to expose a portion of said circuit layout pattern to be electrical contact pads; removing the exposed conducting film uncovered by the first photoresist layer; depositing a second photoresist layer, covering the conducting film exposed in the openings of the first photoresist layer; electroplating Ni/Au covering the surface of the electrical contact pads; removing the first and second photoresists, and the conducting film covered by the photoresists; depositing solder mask on the substrate within an opening to expose said electrical contact pads. It improves the electrical coupling between gold wires and the electrical contact pads of the substrate, prevents the electrical contact pads from oxidation, and insurances the electrical interconnection performance.