公开(公告)号：US11482387B2

公开(公告)日：2022-10-25

申请号：US17031662

申请日：2020-09-24

Applicant: Primax Electronics Ltd.

Inventor： Liu-Bing Cai ,  Li-Xiong Deng ,  Fu-Zhou Wei ,  Li-Qiang Chen ,  Xiao-Ping Wang

IPC: H01H13/06 ,  H01H13/703 ,  H01H13/705

Abstract: A membrane circuit board includes a first film substrate, a second film substrate, an insulating spacer substrate and a waterproof structure. The first circuit layer is installed on the first film substrate. A second circuit layer is installed on the second film substrate. The insulating spacer substrate arranged between the first film substrate and the second film substrate. The first circuit layer is arranged between the first film substrate and the insulating spacer substrate. The second circuit layer is arranged between the second film substrate and the insulating spacer substrate. The waterproof structure includes a first welding layer and a second welding layer. The first welding layer is arranged between the first film substrate and the insulating spacer substrate. The second welding layer is arranged between the second film substrate and the insulating spacer substrate.

公开(公告)号：US20220068575A1

公开(公告)日：2022-03-03

申请号：US17031662

申请日：2020-09-24

Applicant: Primax Electronics Ltd.

Inventor： Liu-Bing Cai ,  Li-Xiong Deng ,  Fu-Zhou Wei ,  Li-Qiang Chen ,  Xiao-Ping Wang

IPC: H01H13/06 ,  H01H13/705 ,  H01H13/703

Abstract: A membrane circuit board includes a first film substrate, a second film substrate, an insulating spacer substrate and a waterproof structure. The first circuit layer is installed on the first film substrate. A second circuit layer is installed on the second film substrate. The insulating spacer substrate arranged between the first film substrate and the second film substrate. The first circuit layer is arranged between the first film substrate and the insulating spacer substrate. The second circuit layer is arranged between the second film substrate and the insulating spacer substrate. The waterproof structure includes a first welding layer and a second welding layer. The first welding layer is arranged between the first film substrate and the insulating spacer substrate. The second welding layer is arranged between the second film substrate and the insulating spacer substrate.