公开(公告)号：US20180039814A1

公开(公告)日：2018-02-08

申请号：US15292562

申请日：2016-10-13

Applicant: Primax Electronics Ltd.

Inventor： MAO-HSIU HSU ,  HSIN-TSO CHEN ,  YING-CHIEH CHUANG

IPC: G06K9/00 ,  H04N17/00

CPC classification number: G06K9/00013 ,  G06K9/00087 ,  H04N17/002

Abstract: A method for assembling the fingerprint identification module is provided. Firstly, a protective cover and a fingerprint sensing element are combined together. Then, the fingerprint sensing element is placed on the circuit board. Then, a triggering element is placed on the circuit board. Then, an adhesive thickness is obtained according to a predetermined thickness and the thicknesses of the protective cover, the fingerprint sensing element, the triggering element and the circuit board. Then, an adhesive film corresponding to the adhesive thickness is placed on the circuit board. Since the appropriate adhesive film is selected according to the demand, the thickness of the fingerprint identification module is substantially identical to the predetermined thickness.