公开(公告)号：US20180129851A1

公开(公告)日：2018-05-10

申请号：US15400174

申请日：2017-01-06

Applicant: Primax Electronics Ltd.

Inventor： MAO-HSIU HSU ,  LI-PIN WANG ,  HONG-KAI HUANG ,  CHIH-HAO HSU

IPC: G06K9/00 ,  B05D3/12 ,  B05D3/02 ,  B05D3/06 ,  B05D5/00

CPC classification number: G06K9/00013 ,  B05D3/0254 ,  B05D3/067 ,  B05D3/12 ,  B05D5/00 ,  G06K9/00087 ,  H01L27/14 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A method for manufacturing a fingerprint identification module is provided. In a step (a), a fingerprint sensor comprising a substrate, a sensing chip and a package layer is provided. The sensing chip is disposed on the substrate. The sensing chip is encapsulated by the package layer. In a step (b), an ink material is coated on the package layer, so that a color ink layer is formed on the package layer. In a step (c), a stamping tool is used to stamp the color ink layer, so that a top surface of the color ink layer becomes a first high gloss surface. In a step (d), the color ink layer to be heated through baking or irradiated with UV light, so that the color ink layer is hardened.