公开(公告)号：US20160149071A1

公开(公告)日：2016-05-26

申请号：US15011812

申请日：2016-02-01

Applicant: Pyreos Ltd.

Inventor： Carsten GIEBELER ,  Neil CONWAY

IPC: H01L31/18

CPC classification number: H01L31/1884 ,  G01J1/44 ,  G01J5/023 ,  G01J5/024 ,  G01J5/046 ,  G01J5/34 ,  G01J2005/345 ,  H01L37/02 ,  H01L37/025 ,  H01L41/316

Abstract: A Method for producing a microsystem (1) with pixels includes: producing a thermal silicon oxide layer on the surface of a silicon wafer as a base layer (5) by oxidation of the silicon wafer; producing a silicon oxide thin layer on the base layer as a carrier layer (6)by thermal deposition; producing a platinum layer on the carrier layer by thermal deposition, whereby an intermediate product is produced; cooling the intermediate product to room temperature; pixel-like structuring of the platinum layer by removing surplus areas of the platinum layer, whereby bottom electrodes (8, 12) of the pixels (7, 8) are formed in pixel shape on the carrier layer in remaining areas; removing material on the side of the silicon wafer facing away from the base layer, so a frame (3) remains and a membrane (4) formed by the base layer and the carrier layer is spanned by the frame.

Abstract translation: 一种用于制造具有像素的微系统（1）的方法包括：通过硅晶片的氧化在硅晶片的表面上形成作为基底层（5）的热氧化硅层; 通过热沉积在基底层上形成作为载体层（6）的氧化硅薄层; 通过热沉积在载体层上产生铂层，由此产生中间产物; 将中间产物冷却至室温; 通过去除铂层的剩余区域来形成铂层的像素结构，由此像素（7,8）的底部电极（8,12）以剩余区域中的载体层上的像素形状形成; 去除硅晶片背离基底层的材料，因此保留框架（3），并且由基底层和载体层形成的膜（4）被框架横跨。