公开(公告)号：BRPI0709100A2

公开(公告)日：2011-06-28

申请号：BRPI0709100

申请日：2007-03-28

Applicant: QUALCOMM INC

Inventor： KIM JE WOO ,  HAN KYUNG SUP ,  RAKYTYANSKYY VOLODYMYR ,  SULIMA OLEKSANDR

IPC: H01Q1/38 ,  H01Q1/48 ,  H01Q3/24 ,  H01Q21/00

Abstract: An embodiment of the present invention is a modified inverted-F antenna for wireless communication. The antenna circuit includes a dielectric substrate having a first surface, a radiating stub on the first surface of the dielectric substrate, and a first ground plate on the first surface of the dielectric substrate to couple to ground. The first ground plate includes one or more grounded capacitive stubs spaced apart from the radiating stub. The one or more grounded capacitive stubs tune performance parameters for the antenna circuit.

公开(公告)号：CA2644946C

公开(公告)日：2013-04-30

申请号：CA2644946

申请日：2007-03-28

Applicant: QUALCOMM INC

Inventor： KIM JE WOO ,  HAN KYUNG SUP ,  RAKYTYANSKYY VOLODYMYR ,  SULIMA OLEKSANDR

IPC: H01Q1/38 ,  H01Q1/48 ,  H01Q3/24 ,  H01Q21/00

Abstract: An embodiment of the present invention is a modified inverted-F antenna for wireless communication. The antenna circuit includes a dielectric substrate having a first surface, a radiating stub on the first surface of the dielectric substrate, and a first ground plate on the first surface of the dielectric substrate to couple to ground. The first ground plate includes one or more grounded capacitive stubs spaced apart from the radiating stub. The one or more grounded capacitive stubs tune performance parameters for the antenna circuit.

公开(公告)号：RU2386197C1

公开(公告)日：2010-04-10

申请号：RU2008142532

申请日：2007-03-28

Applicant: QUALCOMM INC

Inventor： KIM DZE VOO ,  KHAN KIUNG SUP ,  RAKITJANSKIJ VOLODIMIR ,  SULIMA OLEKSANDR

IPC: H01Q1/38

Abstract: Изобретениеотноситсяк областирадиотехники, аименнок компактнымпечатнымантеннамдляабонентскихустройствбеспроводныхширокополосныхсистемсвязии сотовыхтелефонов. Устройствовключаетв себядиэлектрическуюподложку, имеющуюпервуюповерхность, излучающийшлейфнапервойповерхностидиэлектрическойподложкии первуюпластинузаземлениянапервойповерхностидиэлектрическойподложкидлясоединенияс землей. Перваяпластиназаземлениявключаетв себяодинилиболеезаземленныхемкостныхшлейфов, разнесенныхотизлучающегошлейфа. Одинилиболеезаземленныхемкостныхшлейфовнастраиваютрабочиехарактеристикиантеннойцепи. 3 н. и 27 з.п. ф-лы, 15 ил.

公开(公告)号：CA2644946A1

公开(公告)日：2007-11-08

申请号：CA2644946

申请日：2007-03-28

Applicant: QUALCOMM INC

Inventor： HAN KYUNG SUP ,  KIM JE WOO ,  RAKYTYANSKYY VOLODYMYR ,  SULIMA OLEKSANDR

IPC: H01Q1/38 ,  H01Q1/48 ,  H01Q3/24 ,  H01Q21/00

Abstract: An embodiment of the present invention is a modified inverted-F antenna for wireless communication. The antenna circuit includes a dielectric substrate having a first surface, a radiating stub on the first surface of the dielectric substrate, and a first ground plate on the first surface of the dielectric substrate to couple to ground. The first ground plate includes one or more grounded capacitive stubs spaced apart from the radiating stub. The one or more grounded capacitive stubs tune performance parameters for the antenna circuit.

公开(公告)号：WO2007126897A3

公开(公告)日：2008-11-06

申请号：PCT/US2007007694

申请日：2007-03-28

Applicant: QUALCOMM INC ,  KIM JE WOO ,  HAN KYUNG SUP ,  RAKYTYANSKYY VOLODYMYR ,  SULIMA OLEKSANDR

Inventor： KIM JE WOO ,  HAN KYUNG SUP ,  RAKYTYANSKYY VOLODYMYR ,  SULIMA OLEKSANDR

IPC: H01Q1/38 ,  H01Q1/48 ,  H01Q3/24 ,  H01Q21/00

CPC classification number: H01Q9/0421 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q9/42 ,  H01Q21/28

Abstract: An embodiment of the present invention is a modified inverted-F antenna for wireless communication. The antenna circuit includes a dielectric substrate having a first surface, a radiating stub on the first surface of the dielectric substrate, and a first ground plate on the first surface of the dielectric substrate to couple to ground. The first ground plate includes one or more grounded capacitive stubs spaced apart from the radiating stub. The one or more grounded capacitive stubs tune performance parameters for the antenna circuit.

Abstract translation: 本发明的实施例是用于无线通信的改进的倒F型天线。 天线电路包括具有第一表面的电介质基底，介电基底的第一表面上的辐射短截线，以及介电基片的第一表面上的第一接地板，以耦合到地面。 第一接地板包括与辐射短截线间隔开的一个或多个接地电容短截线。 一个或多个接地电容性短线调谐天线电路的性能参数。

公开(公告)号：EP2005518A4

公开(公告)日：2014-06-04

申请号：EP07754244

申请日：2007-03-28

Applicant: QUALCOMM INC

Inventor： KIM JE WOO ,  HAN KYUNG SUP ,  RAKYTYANSKYY VOLODYMYR ,  SULIMA OLEKSANDR

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q9/42 ,  H01Q21/28

CPC classification number: H01Q9/0421 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q9/42 ,  H01Q21/28

Abstract: An embodiment of the present invention is a modified inverted-F antenna for wireless communication. The antenna circuit includes a dielectric substrate having a first surface, a radiating stub on the first surface of the dielectric substrate, and a first ground plate on the first surface of the dielectric substrate to couple to ground. The first ground plate includes one or more grounded capacitive stubs spaced apart from the radiating stub. The one or more grounded capacitive stubs tune performance parameters for the antenna circuit.

Abstract translation: 本发明的实施例是用于无线通信的改进的倒F型天线。 天线电路包括具有第一表面的电介质基底，介电基底的第一表面上的辐射短截线，以及介电基片的第一表面上的第一接地板，以耦合到地面。 第一接地板包括与辐射短截线间隔开的一个或多个接地电容短截线。 一个或多个接地电容性短线调谐天线电路的性能参数。