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    HIGH PERFORMANCE STATION
    7.
    发明专利
    HIGH PERFORMANCE STATION 未知

    公开(公告)号：CA2674062A1

    公开(公告)日：2008-07-17

    申请号：CA2674062

    申请日：2008-01-02

    Applicant: QUALCOMM INC

    Inventor： STEELE GREGORY C ,  VAN NEE RICHARD D J

    IPC: H05K13/04 ,  H05K13/08

    Abstract: A stencil printer apparatus for depositing a solder paste onto the surfac e of the electronic substrate, comprising a frame, a stencil coupled to the frame, the stencil having a plurality of apertures, a dispenser coupled to t he frame, the stencil and the dispenser being configured to deposit the sold er paste onto the electronic substrate, an imaging system (121) constructed and arranged to capture an image of the electronic substrate, and a controll er coupled to the imaging- system and configured to control movement of the imaging system to capture the image. The imaging system (121) comprises a ca mera element (201, 203) configured to capture the image of at least the port ion of the surface of the electronic substrate (111), and a first illuminati on element (209) comprising a long-wavelength light source configured to ill uminate at least the portion of the surface of the electronic substrate by g enerating long-wavelength light. Other embodiments and methods are disclosed .

    HIGH PERFORMANCE STATION
    9.
    发明申请
    HIGH PERFORMANCE STATION 审中-公开
    高性能站

    公开(公告)号：WO2008086063A3

    公开(公告)日：2008-11-20

    申请号：PCT/US2008050058

    申请日：2008-01-02

    Applicant: QUALCOMM INC ,  STEELE GREGORY C ,  VAN NEE RICHARD D J

    Inventor： STEELE GREGORY C ,  VAN NEE RICHARD D J

    IPC: H05K13/04 ,  H05K13/08

    CPC classification number: H04L27/3863 ,  H04B7/0413 ,  H04L1/0003 ,  H04L1/0009 ,  H04L1/0026 ,  H04L1/206 ,  H04L25/0204 ,  H04L25/0216 ,  H04L25/061 ,  H04L27/2647 ,  H04L2025/03426 ,  H04L2027/0016

    Abstract: A stencil printer apparatus for depositing a solder paste onto the surface of the electronic substrate, comprising a frame, a stencil coupled to the frame, the stencil having a plurality of apertures, a dispenser coupled to the frame, the stencil and the dispenser being configured to deposit the solder paste onto the electronic substrate, an imaging system (121) constructed and arranged to capture an image of the electronic substrate, and a controller coupled to the imaging- system and configured to control movement of the imaging system to capture the image. The imaging system (121) comprises a camera element (201, 203) configured to capture the image of at least the portion of the surface of the electronic substrate (111), and a first illumination element (209) comprising a long-wavelength light source configured to illuminate at least the portion of the surface of the electronic substrate by generating long-wavelength light. Other embodiments and methods are disclosed.

    Abstract translation: 一种用于将焊膏沉积到电子基板的表面上的模版印刷装置，包括框架，耦合到框架的模板，具有多个孔的模板，耦合到框架的分配器，模板和分配器被配置 将焊膏沉积到电子基板上，构造和布置成捕获电子基板的图像的成像系统（121）和耦合到成像系统并被配置为控制成像系统的拍摄以捕获图像的控制器 。 成像系统（121）包括被配置为捕获电子基板（111）的至少部分表面的图像的照相机元件（201,203）和包括长波长光的第一照明元件（209） 源被配置为通过产生长波长的光来照亮电子基板的表面的至少一部分。 公开了其他实施例和方法。

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