公开(公告)号：SG11202004598QA

公开(公告)日：2020-07-29

申请号：SG11202004598Q

申请日：2018-12-11

Applicant: QUALCOMM INC

Inventor： ZHANG YU ,  WHITE DOUGLAS BRUCE

IPC: H05K1/02 ,  H01P1/26 ,  H05K1/11 ,  H05K9/00

Abstract: Disclosed is a printed circuit board (PCB) including a set of stacked metallization layers separated by a set of stacked electrical-insulating layers, respectively, wherein the set of stacked metallization layers includes top metallization layer, bottom metallization layer, and intermediate metallization layer; a via electrically coupled to the top metallization layer, the intermediate metallization layer, and the bottom metallization layer, wherein the top metallization layer, a portion of the via between the top metallization layer and the intermediate metallization layer, and the intermediate metallization layer are configured to route a data signal between a signal-in and a signal-out; and an electromagnetic absorbing material configured to reduce an intensity of a reflected signal resulting from the data signal propagating downward along a stub of the via and reflecting off the bottom metallization layer. The electromagnetic absorbing material may be attached to a bottom of the PCB and/or coaxially attached to the stub.