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公开(公告)号:EP4463787A1
公开(公告)日:2024-11-20
申请号:EP23704608.1
申请日:2023-01-05
Applicant: QUALCOMM INCORPORATED
Inventor: BEITH, Scott , DANE, Gokce , BOOTH, Simon Peter William , BANDI, Rohit
公开(公告)号:EP4463787A1
公开(公告)日:2024-11-20
申请号:EP23704608.1
申请日:2023-01-05
Applicant: QUALCOMM INCORPORATED
Inventor: BEITH, Scott , DANE, Gokce , BOOTH, Simon Peter William , BANDI, Rohit