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公开(公告)号：EP4523415A1
公开(公告)日：2025-03-19
申请号：EP23727439.4
申请日：2023-04-20
Applicant: QUALCOMM INCORPORATED
Inventor： HOLMES, Samuel Benjamin , WICKS, Jonathan , CHOPRA, Arjun , RENSCHLER, Martin
IPC: H04N19/587 , G06T19/00 , H04N19/107 , H04N19/132 , H04N19/577
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