公开(公告)号：WO2023044511A1

公开(公告)日：2023-03-23

申请号：PCT/US2022/077113

申请日：2022-09-27

Applicant: QUALCOMM INCORPORATED

Inventor： STROHMANN, Jessica Liu ,  PANCHAWAGH, Hrishikesh Vijaykumar ,  KUO, Nai-Kuei ,  LU, Yipeng ,  LOPEZ, Ali ,  DJORDJEV, Kostadin Dimitrov

IPC: G06V40/13 ,  G06V40/12 ,  G06F21/32 ,  B06B1/06

Abstract: Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.

公开(公告)号：WO2023044200A1

公开(公告)日：2023-03-23

申请号：PCT/US2022/074552

申请日：2022-08-04

Applicant: QUALCOMM INCORPORATED

Inventor： STROHMANN, Jessica Liu ,  PANCHAWAGH, Hrishikesh Vijaykumar ,  KUO, Nai-Kuei ,  LU, Yipeng ,  LOPEZ, Ali ,  DJORDJEV, Kostadin Dimitrov

IPC: G06V40/13 ,  G01S15/02 ,  G01S15/89 ,  B06B1/06

Abstract: Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.

公开(公告)号：EP4402655A1

公开(公告)日：2024-07-24

申请号：EP22773076.9

申请日：2022-08-04

Applicant: QUALCOMM INCORPORATED

Inventor： STROHMANN, Jessica Liu ,  PANCHAWAGH, Hrishikesh Vijaykumar ,  KUO, Nai-Kuei ,  LU, Yipeng ,  LOPEZ, Ali ,  DJORDJEV, Kostadin Dimitrov

IPC: G06V40/13 ,  G01S15/02 ,  G01S15/89 ,  B06B1/06

CPC classification number: G06V40/1306 ,  G06V40/1329 ,  G01S15/8925 ,  B06B1/0629 ,  B06B1/0292 ,  G01S15/8952 ,  G01S7/52079

公开(公告)号：EP4402656A1

公开(公告)日：2024-07-24

申请号：EP22790182.4

申请日：2022-09-27

Applicant: QUALCOMM INCORPORATED

Inventor： STROHMANN, Jessica Liu ,  PANCHAWAGH, Hrishikesh Vijaykumar ,  KUO, Nai-Kuei ,  LU, Yipeng ,  LOPEZ, Ali ,  DJORDJEV, Kostadin Dimitrov

IPC: G06V40/13 ,  G06V40/12 ,  G06F21/32 ,  B06B1/06

CPC classification number: B06B1/067 ,  G06F21/44 ,  G06F21/75 ,  G06V40/1306 ,  G06V40/1365

公开(公告)号：EP4470681A3

公开(公告)日：2025-02-12

申请号：EP24207023.3

申请日：2022-08-04

Applicant: QUALCOMM Incorporated

Inventor： STROHMANN, Jessica Liu ,  PANCHAWAGH, Hrishikesh Vijaykumar ,  KUO, Nai-Kuei ,  LU, Yipeng ,  LOPEZ, Ali ,  DJORDJEV, Kostadin Dimitrov

IPC: G06V40/13 ,  G01S15/02 ,  G01S15/89 ,  G01S7/52 ,  B06B1/02 ,  B06B1/06

Abstract: Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.

公开(公告)号：EP4470681A2

公开(公告)日：2024-12-04

申请号：EP24207023.3

申请日：2022-08-04

Applicant: QUALCOMM Incorporated

Inventor： STROHMANN, Jessica Liu ,  PANCHAWAGH, Hrishikesh Vijaykumar ,  KUO, Nai-Kuei ,  LU, Yipeng ,  LOPEZ, Ali ,  DJORDJEV, Kostadin Dimitrov

IPC: B06B1/06

Abstract: Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.