公开(公告)号：WO2016130436A1

公开(公告)日：2016-08-18

申请号：PCT/US2016/016828

申请日：2016-02-05

Applicant: QUALCOMM INCORPORATED

Inventor： CHENG, Steven Derchung ,  MITTER, Vinay

IPC: G06F13/16 ,  G06F12/10

CPC classification number: G06F3/0608 ,  G06F3/064 ,  G06F3/0661 ,  G06F3/0679 ,  G06F12/1009 ,  G06F13/1668

Abstract: Various embodiments of methods and systems for dynamically managing the capacity utilization of a memory component in a system on a chip ("SoC") are disclosed. Memory utilization is optimized in certain embodiments through dynamic compression and decompression within a memory subsystem. Based on parameters of the SoC that are indicative of a quality of service ("QoS") level, a memory controller may determine that the format of the data in a write request should be converted and stored in a relinked memory address. Subsequently, a primary memory address associated with the data may be released for storage of different data. Similarly, embodiments may return data requested in a write request in a format different than that which was requested.

Abstract translation: 公开了用于动态管理芯片上系统（“SoC”）中的存储器组件的容量利用的方法和系统的各种实施例。 在某些实施例中，通过在存储器子系统内的动态压缩和解压缩来优化存储器利用。 基于指示服务质量（“QoS”）级别的SoC的参数，存储器控制器可以确定写入请求中的数据的格式应该被转换并存储在重新链接的存储器地址中。 随后，可以释放与数据相关联的主存储器地址以存储不同的数据。 类似地，实施例可以以与请求的格式不同的格式返回在写入请求中请求的数据。

公开(公告)号：EP2929409A1

公开(公告)日：2015-10-14

申请号：EP13798418.3

申请日：2013-10-24

Applicant: Qualcomm Incorporated

Inventor： JAIN, Ankur ,  DOSHI, Paras, S. ,  VADAKKANMARUVEEDU, Unnikrishnan ,  MITTER, Vinay

IPC: G06F1/20 ,  G06F1/32

CPC classification number: G05D23/19 ,  G01K7/00 ,  G06F1/206 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F15/00 ,  Y02D10/126 ,  Y02D10/16

Abstract: Various embodiments of methods and systems for estimating environmental ambient temperature of a portable computing device (“PCD”) from temperature measurements taken within the PCD are disclosed. In an exemplary embodiment, it may be recognized that the PCD is in an idle state, thus producing little or no thermal energy. Temperature measurements are then taken from temperature sensors within the PCD and used to estimate the environmental ambient temperature to which the PCD is exposed. Certain embodiments may simply render the estimated ambient temperature for the benefit of the user or use the estimated ambient temperature as an input to a program or application running on the PCD. It is envisioned that certain embodiments of the systems and methods may use the estimated ambient temperature to adjust temperature thresholds in the PCD against which thermal management policies govern thermally aggressive processing components.

公开(公告)号：WO2015010044A1

公开(公告)日：2015-01-22

申请号：PCT/US2014/047231

申请日：2014-07-18

Applicant: QUALCOMM INCORPORATED

Inventor： JAIN, Ankur ,  VADAKKANMARUVEEDU, Unnikrishnan ,  MITTER, Vinay ,  BEGIN, Henri ,  CHIDAMBARAM, Praveen

IPC: G06F1/32

CPC classification number: G06F1/32 ,  G06F1/3203 ,  G06F1/3243

Abstract: Various embodiments of methods and systems for idle state optimization in a portable computing device ("PCD") are disclosed. An exemplary method includes comparing an aggregate power consumption level for all processing cores in the PCD to a power budget and, if there is available headroom in the power budget, transitioning cores operating in a first idle state to a different idle state. In doing so, the latency value associated with bringing the transitioned cores out of an idle state and into an active state, should the need arise, may be reduced. The result is that user experience and QoS may be improved as an otherwise idle core in an idle state with a long latency time may be better positioned to quickly transition to an active state and process a workload.

Abstract translation: 公开了便携式计算设备（“PCD”）中用于空闲状态优化的方法和系统的各种实施例。 一种示例性方法包括将PCD中的所有处理核心的总功耗级别与功率预算进行比较，并且如果在功率预算中存在可用余量，则将在第一空闲状态中操作的核心转换到不同的空闲状态。 在这样做时，如果需要，可以减少与将转换的核心从空闲状态转变为活动状态相关联的延迟值。 结果是可以改善用户体验和QoS，因为空闲状态下的空闲核心具有长延迟时间可能更好地定位成快速转换到活动状态并处理工作负载。

公开(公告)号：WO2014088719A1

公开(公告)日：2014-06-12

申请号：PCT/US2013/066513

申请日：2013-10-24

Applicant: QUALCOMM INCORPORATED

Inventor： JAIN, Ankur ,  DOSHI, Paras, S. ,  VADAKKANMARUVEEDU, Unnikrishnan ,  MITTER, Vinay

IPC: G06F1/20 ,  G06F1/32

CPC classification number: G05D23/19 ,  G01K7/00 ,  G06F1/206 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F15/00 ,  Y02D10/126 ,  Y02D10/16

Abstract: Various embodiments of methods and systems for estimating environmental ambient temperature of a portable computing device (PCD) from temperature measurements taken within the PCD are disclosed. In an exemplary embodiment, it may be recognized that the PCD is in an idle state, thus producing little or no thermal energy. Temperature measurements are then taken from temperature sensors within the PCD and used to estimate the environmental ambient temperature to which the PCD is exposed. Certain embodiments may simply render the estimated ambient temperature for the benefit of the user or use the estimated ambient temperature as an input to a program or application running on the PCD. It is envisioned that certain embodiments of the systems and methods may use the estimated ambient temperature to adjust temperature thresholds in the PCD against which thermal management policies govern thermally aggressive processing components.

Abstract translation: 公开了根据在PCD内进行的温度测量来估计便携式计算设备（PCD）的环境温度的方法和系统的各种实施例。 在示例性实施例中，可以认识到PCD处于空闲状态，因此产生很少的或没有热能。 然后从PCD内的温度传感器获取温度测量值，并用于估算PCD暴露于的环境温度。 某些实施例可以简单地使估计的环境温度为用户的利益或使用估计的环境温度作为在PCD上运行的程序或应用的输入。 可以设想，系统和方法的某些实施例可以使用估计的环境温度来调整PCD中的温度阈值，热管理策略对该温度阈值控制热侵蚀性处理组件。

公开(公告)号：WO2014003902A2

公开(公告)日：2014-01-03

申请号：PCT/US2013/040787

申请日：2013-05-13

Applicant: QUALCOMM INCORPORATED

Inventor： DOSHI, Paras S. ,  JAIN, Ankur ,  VADAKKANMARUVEEDU, Unnikrishnan ,  MITTER, Vinay ,  VOOTUKURU, Anil ,  ALTON, Ronald F. ,  ANDERSON, Jon J.

IPC: G06F1/20

CPC classification number: G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3287 ,  G06F1/3296 ,  G06F11/3031 ,  G06F11/3037 ,  G06F11/3058 ,  Y02D10/126 ,  Y02D10/172

Abstract: Various embodiments of methods and systems for adaptive thermal management techniques implemented in a portable computing device (PCD) are disclosed. Notably, in many PCDs, temperature thresholds associated with various components in the PCD such as, but not limited to, die junction temperatures, package on package (PoP) memory temperatures and the touch temperature of the external surfaces of the device itself limits the extent to which the performance capabilities of the PCD can be exploited. It is an advantage of the various embodiments of methods and systems for adaptive thermal management that, when a temperature threshold is violated, the performance of the PCD is sacrificed only as much and for as long as necessary to clear the violation before authorizing the thermally aggressive processing component(s) to return to a maximum operating power.

Abstract translation: 公开了在便携式计算设备（PCD）中实现的用于自适应热管理技术的方法和系统的各种实施例。 值得注意的是，在许多PCD中，与PCD中的各种组件相关的温度阈值，例如但不限于芯片结温度，封装封装（PoP）存储器温度以及器件外部表面的触摸温度限制了其程度 可以利用PCD的性能功能。 对于自适应热管理的方法和系统的各种实施例的优点是，当违反温度阈值时，PCD的性能只有在必须清除违规之前才被牺牲，在授权热攻击之前 处理组件返回到最大操作功率。

公开(公告)号：WO2017172752A1

公开(公告)日：2017-10-05

申请号：PCT/US2017/024517

申请日：2017-03-28

Applicant: QUALCOMM INCORPORATED

Inventor： WANG, Peng ,  VADAKKANMARUVEEDU, Unnikrishnan ,  MITTER, Vinay

IPC: G06F1/20 ,  H01L23/38 ,  H01L35/30 ,  H01L35/32

Abstract: An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the first and second electrodes, heat from a heat source may be transferred laterally within the TE layer from the first electrode to the second electrode.

Abstract translation: 提出了一种主动传热装置，用于诸如移动装置的设备中的热量管理。 所提出的传热装置可以包括热电（TE）层以及均位于TE层的侧表面上的第一和第二电极。 当第一电极和第二电极之间存在电压差时，来自热源的热量可以在TE层内从第一电极侧向地转移到第二电极。

公开(公告)号：WO2016160224A1

公开(公告)日：2016-10-06

申请号：PCT/US2016/020002

申请日：2016-02-29

Applicant: QUALCOMM INCORPORATED

Inventor： VOOTUKURU, Anil ,  JAIN, Ankur ,  VADAKKANMARUVEEDU, Unnikrishnan ,  MITTER, Vinay ,  MEDRANO, Christopher Lee

IPC: G06F1/20 ,  G06F1/32 ,  G05D23/19 ,  G01K7/42

CPC classification number: G06F1/206 ,  G01K7/427 ,  G01K13/00 ,  G05B15/02 ,  G06F1/203 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3243 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/152 ,  Y02D10/172

Abstract: Thermal management in a portable computing device differentiates between a temperature increase caused by a steady workload and a temperature increase caused by an instantaneous workload. If it is determined that a detected temperature increase is caused by a steady workload, then a configuration of thermal parameters is applied that optimizes thermal performance for a steady workload. If it is determined that a temperature increase is caused by an instantaneous workload increase, then a configuration of thermal parameters is applied that optimizes thermal performance for an instantaneous workload. The device includes at least one first temperature sensor on an integrated circuit die and at least one second temperature sensor not on the integrated circuit die but within a housing of the portable computing device. The workload is determined by computing a difference between a first temperature value responsive to the at least one first temperature sensor and a second temperature value responsive to the at least one second temperature sensor and comparing the difference with a threshold value.

Abstract translation: 便携式计算设备中的热管理区分由稳定的工作负载导致的温度升高和由瞬时工作量引起的温度升高。 如果确定检测到的温度升高是由稳定的工作量引起的，则应用热参数的配置，其优化用于稳定工作负载的热性能。 如果确定温度升高是由瞬间工作量增加引起的，则应用热参数的配置，其优化了瞬时工作负荷的热性能。 该装置包括集成电路管芯上的至少一个第一温度传感器和不在集成电路管芯上但在便携式计算设备的外壳内的至少一个第二温度传感器。 通过计算响应于至少一个第一温度传感器的第一温度值和响应于至少一个第二温度传感器的第二温度值之间的差异并将差值与阈值进行比较来确定工作负荷。

公开(公告)号：WO2016064657A1

公开(公告)日：2016-04-28

申请号：PCT/US2015/055829

申请日：2015-10-15

Applicant: QUALCOMM INCORPORATED

Inventor： GADELRAB, Serag ,  DUROIU, Cristian ,  CHAMARTY, Vinod ,  SINHA, Pooja ,  CHAPARRO, John Daniel ,  VOOTUKURU, Anil ,  CUPPU, Vinodh Ramesh ,  LEE, Joseph Schweiray ,  MITTER, Vinay ,  CHOW, Paul ,  LIU, Ruolong ,  KUAN, Johnny Jone Wai

IPC: G06F11/07

CPC classification number: G06F11/0781 ,  G06F1/08 ,  G06F11/0742 ,  G06F11/0793 ,  G06F13/4022

Abstract: A method and system for adjusting bandwidth within a portable computing device based on danger signals monitored from one on more elements of the portable computing device are disclosed. A danger level of an unacceptable deadline miss ("UDM") element of the portable computing device may be determined with a danger level sensor within the UDM element. Next, a quality of service ("QoS") controller may adjust a magnitude for one or more danger levels received based on the UDM element type that generated the danger level and based on a potential fault condition type associated with the particular danger level. The danger levels received from one UDM element may be mapped to at least one of another UDM element and a non-UDM element. A quality of service policy for each UDM element and non-UDM element may be mapped in accordance with the danger levels.

Abstract translation: 公开了一种用于基于从便携式计算设备的更多元件监控的危险信号来调整便携式计算设备内的带宽的方法和系统。 可以使用UDM元件内的危险水平传感器来确定便携式计算设备的不可接受的期限错误（“UDM”）元件的危险等级。 接下来，服务质量（“QoS”）控制器可以基于生成危险等级的UDM元素类型并且基于与特定危险等级相关联的潜在故障条件类型来调整接收到的一个或多个危险等级的大小。 从一个UDM元件接收到的危险等级可被映射到另一UDM元件和非UDM元件中的至少一个。 可以根据危险等级映射每个UDM元素和非UDM元素的服务质量策略。

公开(公告)号：WO2014134211A1

公开(公告)日：2014-09-04

申请号：PCT/US2014/018774

申请日：2014-02-26

Applicant: QUALCOMM INCORPORATED

Inventor： VADAKKANMARUVEEDU, Unnikrishnan ,  DOSHI, Paras S. ,  JAIN, Ankur ,  MITTER, Vinay ,  STEWART, RICHARD A.

IPC: G06F1/20 ,  G06F1/32

CPC classification number: G06F1/26 ,  G06F1/203 ,  G06F1/206 ,  G06F1/324 ,  G06F1/3296 ,  G06F2217/80 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

Abstract: Various embodiments of methods and systems for thermal energy management in a portable computing device ("PCD")based on power level calculations are disclosed.An exemplary method includes tracking instantaneous operating temperatures and active power supply levels to one or more components. With an estimate or measurement of ambient temperature, the instantaneous operating temperature values and active power supply level values can be used to calculate an instantaneous thermal resistance value. In the event that thermal energy generation should be managed, a target operating temperature may be used with the ambient temperature and the instantaneous thermal resistance value to solve for an optimum power supply level. The active power supply level may then be adjusted based on the calculated optimum power supply level.

Abstract translation: 公开了基于功率电平计算的便携式计算设备（“PCD”）中用于热能管理的方法和系统的各种实施例。一种示例性方法包括将瞬时工作温度和有功功率供应水平跟踪到一个或多个组件。 通过对环境温度的估计或测量，可以使用瞬时工作温度值和有功电源电平值来计算瞬时热阻值。 在管理热能产生的情况下，可以使用目标工作温度与环境温度和瞬时热阻值来求解最佳供电水平。 然后可以基于计算的最佳电源电平来调整有功电源电平。

公开(公告)号：EP3278193A1

公开(公告)日：2018-02-07

申请号：EP16709646.0

申请日：2016-02-29

Applicant: Qualcomm Incorporated

Inventor： VOOTUKURU, Anil ,  JAIN, Ankur ,  VADAKKANMARUVEEDU, Unnikrishnan ,  MITTER, Vinay ,  MEDRANO, Christopher Lee

IPC: G06F1/20 ,  G06F1/32 ,  G05D23/19 ,  G01K7/42

CPC classification number: G06F1/206 ,  G01K7/427 ,  G01K13/00 ,  G05B15/02 ,  G06F1/203 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3243 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/152 ,  Y02D10/172

Abstract: Thermal management in a portable computing device differentiates between a temperature increase caused by a steady workload and a temperature increase caused by an instantaneous workload. If it is determined that a detected temperature increase is caused by a steady workload, then a configuration of thermal parameters is applied that optimizes thermal performance for a steady workload. If it is determined that a temperature increase is caused by an instantaneous workload increase, then a configuration of thermal parameters is applied that optimizes thermal performance for an instantaneous workload.