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公开(公告)号：WO2014123925A1
公开(公告)日：2014-08-14
申请号：PCT/US2014/014710
申请日：2014-02-04
Applicant: QUALCOMM INCORPORATED
Inventor： PATEL, Hardik M. , SUTTON, Todd R. , BOSSU, Frederic , ROSOLOWSKI, Chris M. , O'SHEA, Helena Deirdre
CPC classification number: H04W52/0225 , H04W52/0245 , Y02D70/00
Abstract: Exemplary embodiments are related to enhancing power efficiency of an electronic device. A device may include a power management module and a radio-frequency (RF) module coupled to the power management module. The device may further include a digital module coupled to each of the power management module and the RF module and configured to dynamically adjust at least one setting of the power management module based on one or more RF conditions.
Abstract translation: 示例性实施例涉及提高电子设备的功率效率。 设备可以包括耦合到电源管理模块的电源管理模块和射频（RF）模块。 该设备还可以包括耦合到每个电源管理模块和RF模块的数字模块，并且被配置为基于一个或多个RF条件来动态地调整功率管理模块的至少一个设置。
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公开(公告)号：WO2014150283A3
公开(公告)日：2014-09-25
申请号：PCT/US2014/022827
申请日：2014-03-10
Applicant: QUALCOMM INCORPORATED
Inventor： MEHTA, Narendra Singh , ROSOLOWSKI, Chris M. , DHAR, Sandeep Chaman , SUTTON, Todd R.
Abstract: An electronic device is described. The electronic device includes a first port. The electronic device also includes a second port. The electronic device further includes a multiphase charger. The multiphase charger includes a first buck. The multiphase charger also includes a second buck. The multiphase charger further includes a first port switch. The multiphase charger also includes a second port switch. The multiphase charger further includes a reverse boost switch. The multiphase charger also includes a multiphase switch.
Abstract translation: 描述了一种电子设备。 电子设备包括第一端口。 电子设备还包括第二端口。 电子设备还包括多相充电器。 多相充电器包括第一个降压。 多相充电器还包括第二个降压。 多相充电器还包括第一端口开关。 多相充电器还包括第二个端口开关。 多相充电器还包括反向升压开关。 多相充电器还包括一个多相开关。
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Patent Agency Ranking
公开(公告)号：WO2012112621A1
公开(公告)日：2012-08-23
申请号：PCT/US2012/025135
申请日：2012-02-14
Applicant: QUALCOMM INCORPORATED , WILCOX, Rick A. , FILIPOVIC, Daniel F. , CHI, Xu Mike , ROSOLOWSKI, Chris M.
Inventor： WILCOX, Rick A. , FILIPOVIC, Daniel F. , CHI, Xu Mike , ROSOLOWSKI, Chris M.
Abstract: An apparatus includes a temperature measuring device within a thermally conductive package. A crystal within the package is thermally coupled to the temperature measuring device and subjected to a same temperature as the temperature measuring device. A controller external to the package is configured to receive a signal from the crystal and a temperature measurement from the temperature measuring device. The controller is configured to estimate a frequency error of the crystal based on the temperature measurement and to provide a frequency error estimate to an external system.
Abstract translation: 一种装置包括在导热封装内的温度测量装置。 封装内的晶体热耦合到温度测量装置并经受与温度测量装置相同的温度。 封装外部的控制器被配置为从晶体接收信号和来自温度测量装置的温度测量。 控制器被配置为基于温度测量来估计晶体的频率误差，并且向外部系统提供频率误差估计。
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公开(公告)号：EP2954731A1
公开(公告)日：2015-12-16
申请号：EP14706182.4
申请日：2014-02-04
Applicant: Qualcomm Incorporated
Inventor： PATEL, Hardik M. , SUTTON, Todd R. , BOSSU, Frederic , ROSOLOWSKI, Chris M. , O'SHEA, Helena Deirdre
CPC classification number: H04W52/0225 , H04W52/0245 , Y02D70/00
Abstract: Exemplary embodiments are related to enhancing power efficiency of an electronic device. A device may include a power management module and a radio-frequency (RF) module coupled to the power management module. The device may further include a digital module coupled to each of the power management module and the RF module and configured to dynamically adjust at least one setting of the power management module based on one or more RF conditions.
Abstract translation: 示例性实施例涉及提高电子设备的功率效率。 一种设备可以包括电源管理模块和耦合到电源管理模块的射频（RF）模块。 该设备还可以包括耦合到每个电源管理模块和RF模块的数字模块，并且被配置为基于一个或多个RF条件来动态地调整功率管理模块的至少一个设置。
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公开(公告)号：EP2676364B1
公开(公告)日：2020-01-01
申请号：EP12705943.4
申请日：2012-02-14
Applicant: Qualcomm Incorporated
Inventor： WILCOX, Rick A. , FILIPOVIC, Daniel F. , CHI, Xu Mike , ROSOLOWSKI, Chris M.
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公开(公告)号：EP3629474A1
公开(公告)日：2020-04-01
申请号：EP19210291.1
申请日：2012-02-14
Applicant: QUALCOMM Incorporated
Inventor： WILCOX, Rick A. , FILIPOVIC, Daniel F. , CHI, Xu Mike , ROSOLOWSKI, Chris M.
Abstract: An apparatus includes a temperature measuring device within a thermally conductive package. A crystal within the package is thermally coupled to the temperature measuring device and subjected to a same temperature as the temperature measuring device. A controller external to the package is configured to receive a signal from the crystal and a temperature measurement from the temperature measuring device. The controller is configured to estimate a frequency error of the crystal based on the temperature measurement and to provide a frequency error estimate to an external system.
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7.发明公开
公开(公告)号：EP2676364A1
公开(公告)日：2013-12-25
申请号：EP12705943.4
申请日：2012-02-14
Applicant: Qualcomm Incorporated
Inventor： WILCOX, Rick A. , FILIPOVIC, Daniel F. , CHI, Xu Mike , ROSOLOWSKI, Chris M.
Abstract: An apparatus includes a temperature measuring device within a thermally conductive package. A crystal within the package is thermally coupled to the temperature measuring device and subjected to a same temperature as the temperature measuring device. A controller external to the package is configured to receive a signal from the crystal and a temperature measurement from the temperature measuring device. The controller is configured to estimate a frequency error of the crystal based on the temperature measurement and to provide a frequency error estimate to an external system.
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