Abstract:
PROBLEM TO BE SOLVED: To provide a method and a device for packaging a substrate. SOLUTION: There is provided a package structure and a method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or a cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an array of interferometric modulators comprising a backplate to protect an interferometric modulator from mechanical interference, excessive moisture, and other potentially damaging substances.SOLUTION: In a MEMS-based display device 600, an array 604 of interferometric modulators is configured to reflect light through a transparent substrate. The transparent substrate is attached with a seal 606 to a backplate 608 and the backplate can contain electronic circuitry for controlling the array of interferometric modulators. The backplate can become physical support for device components, such as electronic components, which can be used to control states of a display. The backplate can also be utilized as a primary structural support for the device.
Abstract:
PROBLEM TO BE SOLVED: To provide a MEMS-based display device.SOLUTION: The MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate attached to a back plate via a seal and the back plate can contain electronic circuitry for controlling the array of interferometric modulators. The back plate can be a physical support for device components (for example, electronic components etc.) which can be used to control the state of the display. The back plate can also be utilized as a primary structural support for the device.
Abstract:
PROBLEM TO BE SOLVED: To provide a MEMS device having a support structure and a method of fabricating the same.SOLUTION: Embodiments of MEMS devices includes a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.
Abstract:
PROBLEM TO BE SOLVED: To provide an interference modulator and a method of controlling an array of the interference modulator to realize a color system having excellent flexibility with modulation of incident light by manipulating optical properties of a micromechanical device.SOLUTION: The interference modulator includes a plurality of interference modulators. At least one of the interference modulators emits colored light, and at least one of the interference modulators emits white light.
Abstract:
PROBLEM TO BE SOLVED: To create a light absorption inactive area of an IMOD with an optical device covered or in the optical device by reducing the influence of reflection ambient rays of light from a certain specific inactive area of the IMOD in order to improve a desired optical response since it is necessary to create the inactive area of the IMOD with light absorption.SOLUTION: Disclosed is an optical device including: a substrate; a static optical component formed on the substrate such that the rays of light are absorbed with a film stack included; and a dynamic optical component on the substrate, and a method of manufacturing the optical device.
Abstract:
"dispositivo tendo uma máscara absorvedora de luz, e método de fabricação do mesmo". a invenção provê um método para fabricar um dispositivo óptico compreendendo pelo menos um componente óptico formado em um substrato transparente. o método compreende a determinação de uma área do substrato que deve ser absorvedora de luz; e a fabricação de uma máscara absorvedora de luz na área determinada antes de fabricar pelo menos um dito componente óptico. a invenção também provê um dispositivo óptico compreendendo um substrato (102); e um primeiro e um segundo componentes ópticos formados no substrato, onde o primeiro componente óptico (104) tem dois modos, cada modo produzindo uma resposta óptica diferente à luz incidente, e onde o segundo componente óptico (108) absorve luz e é formado no substrato antes do primeiro componente óptico ser formado.
Abstract:
Un aparato (10) de MEMS, que comprende: un sustrato (24, 42, 62); un electrodo (20, 44, 64), en el que el electrodo (20, 44, 64) está ubicado sobre el sustrato (24, 44, 64); una capa transparente (12, 46, 68), estando ubicada la capa transparente (12, 46, 68) sobre el electrodo (20, 46, 68), y comprendiendo la capa transparente (12, 46, 68) SiO2; una capa (48, 70) de captura de carga, estando ubicada la capa (48, 70) de captura de carga sobre la capa transparente (12, 46, 68) e incluye un material que tiene una densidad de captura de carga para manipular la acumulación de la carga sobre la capa transparente (12, 46, 68), y en el que la capa (48, 70) de captura de carga sirve de capa barrera de ataque químico y es resistente a XeF2; un espacio (16) de aire, en el que el espacio (16) de aire está ubicado adyacente a la capa (48, 70) de captura de carga; y una capa desplazable (14), siendo la capa desplazable (14) reflectante de la luz incidente.
Abstract:
An interferometric light modulating device having two viewing surfaces is provided. In some embodiments, the device can generate two distinct images, one on each side of the device, simultaneously.