公开(公告)号：US10257930B2

公开(公告)日：2019-04-09

申请号：US15189435

申请日：2016-06-22

Applicant: R&D CIRCUITS, INC.

Inventor： Thomas P Warwick ,  Dhananjaya Trupuseema ,  James V Russell

IPC: H01R43/00 ,  H05K1/11 ,  H05K3/40 ,  H05K3/10 ,  H05K3/32 ,  H05K1/09 ,  H05K1/02 ,  H05K1/18

Abstract: The present invention provides for a method and structure for forming three-dimensionally routed dielectric wires between discrete points on the two or more parallel circuit planes. The wires may be freely routed in three-dimensional space as to create the most efficient routing between the two arbitrarily defined points on the two or more parallel circuit planes. Metalizing the outer surfaces of these three dimensional dielectric wires electrically coupling the discrete wires to their respective discrete contact points. Two or more of these wires may be in intimate contact to one another electrically coupling to each other as well as to two or more discrete contact pads. These electrically coupled contact pads may be on opposite sides or on the same side of the structure and the formed metalized wires may originate on one side and terminate on the other or originate and terminate from the same side.