公开(公告)号：WO2022174021A1

公开(公告)日：2022-08-18

申请号：PCT/US2022/016090

申请日：2022-02-11

Applicant: R&D CIRCUITS, INC.

Inventor： THOMPSON, Donald, Eric ,  SMITH, Thomas

IPC: H05K3/00

Abstract: The present invention provides a method for detecting failed back-drills in PCBs in the process of fabricating a PCB so that the failed back-drill can be screened out or repaired. The present invention accomplishes this by adding a short to ground connection for every back- drill via that will be cut when the back-drill removes the via stub. If the back-drill is bad or failed the short to ground will fail the subsequent electrical tests. The PCB can be repaired by re- drilling the hole or via. The present invention allows for detecting failed back-drills with easy detection in the manufacturing stage using standard equipment and test procedures. This process creates a simple pass-fail measurement that uses an existing common test process to catch failed back drills in the PCB fabrication facility. This allows for easy and cost- effective repair and guarantees back-drill failures do not pass into the field.

公开(公告)号：WO2018044788A1

公开(公告)日：2018-03-08

申请号：PCT/US2017/048885

申请日：2017-08-28

Applicant: R&D CIRCUITS, INC. ,  THOMPSON, Donald, Eric ,  CANTAIORE, Cosirno

Inventor： THOMPSON, Donald, Eric ,  CANTAIORE, Cosirno

IPC: B29C64/153 ,  H01R12/14 ,  H01R13/40 ,  H05K1/14 ,  H05K3/36

Abstract: The present invention provides for a structure and a mechanism by which by utilising additive manufacturing processes electrical connections are created that connect the top and bottom of a block in a customizable pattern. Specifically connection points can be created on the surface of the block and route them to alternate locations transforming the original pattern to a smaller, larger, or alternate pattern.

Abstract translation: 本发明提供了一种结构和机构，通过利用增材制造工艺，建立了以可定制图案连接块的顶部和底部的电连接。 具体来说，可以在块的表面创建连接点，并将它们路由到其他位置，将原始模式转换为更小，更大或交替的模式。