公开(公告)号：US20250085332A1

公开(公告)日：2025-03-13

申请号：US18958656

申请日：2024-11-25

Applicant: R & D Circuits, Inc.

Inventor： Donald Thompson ,  Thomas Smith

IPC: G01R31/28 ,  G01R31/70 ,  H05K3/00 ,  H05K3/42

Abstract: A method for detecting failed back-drills in PCBs in the process of fabricating a PCB so that the failed back-drill can be screened out or repaired. A short to ground connection is added for every back-drill via that will be cut when the back-drill removes the via stub. If the back-drill is bad or failed the short to ground will fail the subsequent electrical tests. The PCB can be repaired by re-drilling the hole or via. Failed back-drills may be detected in the manufacturing stage using standard equipment and test procedures. This process creates a simple pass-fail measurement that uses an existing common test process to catch failed back drills in the PCB fabrication facility. This allows for easy and cost-effective repair and guarantees back-drill failures do not pass into the field.

公开(公告)号：US12153084B2

公开(公告)日：2024-11-26

申请号：US17173441

申请日：2021-02-11

Applicant: R & D Circuits, Inc.

Inventor： Donald Eric Thompson ,  Thomas Smith

IPC: G01R31/28 ,  G01R31/70 ,  H05K3/00 ,  H05K3/42

Abstract: A method for detecting failed back-drills in PCBs in the process of fabricating a PCB so that the failed back-drill can be screened out or repaired. short to ground connection is added for every back-drill via that will be cut when the back-drill removes the via stub. If the back-drill is bad or failed the short to ground will fail the subsequent electrical tests. The PCB can be repaired by re-drilling the hole or via. Failed back-drills may be detected in the manufacturing stage using standard equipment and test procedures. This process creates a simple pass-fail measurement that uses an existing common test process to catch failed back drills in the PCB fabrication facility. This allows for easy and cost-effective repair and guarantees back-drill failures do not pass into the field.

公开(公告)号：US20220252660A1

公开(公告)日：2022-08-11

申请号：US17173441

申请日：2021-02-11

Applicant: R & D Circuits, Inc.

Inventor： Donald Eric Thompson ,  Thomas Smith

IPC: G01R31/28 ,  G01R31/70 ,  H05K3/42 ,  H05K3/00

Abstract: The present invention provides a method for detecting failed back-drills in PCBs in the process of fabricating a PCB so that the failed back-drill can be screened out or repaired. The present invention accomplishes this by adding a short to ground connection for every back-drill via that will be cut when the back-drill removes the via stub. If the back-drill is bad or failed the short to ground will fail the subsequent electrical tests. The PCB can be repaired by re-drilling the hole or via. The present invention allows for detecting failed back-drills with easy detection in the manufacturing stage using standard equipment and test procedures. This process creates a simple pass-fail measurement that uses an existing common test process to catch failed back drills in the PCB fabrication facility. This allows for easy and cost-effective repair and guarantees back-drill failures do not pass into the field.