INTEGRATED PACKAGE DESIGN FOR A RADIATION SENSING DEVICE AND MANUFACTURING METHOD

    公开(公告)号:WO2005038909A3

    公开(公告)日:2005-04-28

    申请号:PCT/US2004/034302

    申请日:2004-10-16

    Abstract: A radiation detector (10) has a base (30), a frame (48), a window (46), and solder layers (50,52) formed from a solder pre-form to define a vacuum chamber (56). Feedthroughs (18,40,44) penetrate the base (30) for electrical connection to internal components. A method for sealing the detector aligns a lower detector assembly (62), the frame (48), the window (46), and the solder pre-forms (58,60) in a non-sealed relation within a processing chamber (80,94). High temperature and low pressure is imposed, and the getter (42) is activated by resistive heating imposed by current leads. The window (46), frame (48), and lower detector assembly (62) are then pressed together and sealed by the liquefied solder pre-forms (58,60). The method eliminates the need for a seal port, combines several steps within the processing chamber, and eliminates certain prior art cleaning steps.

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