公开(公告)号：WO2019204463A1

公开(公告)日：2019-10-24

申请号：PCT/US2019/027899

申请日：2019-04-17

Applicant: RAYTHEON COMPANY ,  THERMAVANT TECHNOLOGIES, LLC

Inventor： DUONG, Tuan L. ,  LEEDS, Adam D. ,  BENEDICT, James E. ,  BOSWELL, Joseph A. ,  POUNDS, Daniel A.

IPC: B64G1/50

Abstract: An apparatus includes a structure (100) configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes a lid (104) and a body (102). The structure also includes (i) multiple inline and interconnected thermomechanical regions (106-112) and (ii) one or more oscillating heat pipes (114a-114b) embedded in at least some of the thermomechanical regions. Different portions of at least one of the lid and the body form the thermomechanical regions. The one or more oscillating heat pipes are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. Each of the one or more oscillating heat pipes includes at least one channel in the structure.

公开(公告)号：WO2019204322A1

公开(公告)日：2019-10-24

申请号：PCT/US2019/027700

申请日：2019-04-16

Applicant: RAYTHEON COMPANY

Inventor： DUONG, Tuan L. ,  LEEDS, Adam D. ,  BENEDICT, James E.

IPC: B64G1/50

Abstract: A system includes a flight vehicle (502, 602, 700) and one or more deployable radiators (504, 604, 702). Each deployable radiator includes a structure (100, 300) configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes (i) multiple inline and interconnected thermomechanical regions (102-108, 306-312) and (ii) one or more thermal energy transfer devices (202, 314a-314b) embedded in at least some of the thermomechanical regions. The one or more thermal energy transfer devices are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. The thermomechanical regions may include one or more heat input regions (102, 306) configured to receive the thermal energy, one or more heat rejection regions (108, 312) configured to reject the thermal energy into the external environment, and one or more morphable regions (104, 308) including the one or more shape-memory materials and configured to change shape.