Abstract:
A photolithography step is carried out for exposing/etching a resist film in an etching step. Thereafter a superposition inspection step employing a superposed layer superposition mark and a resist film superposition mark is carried out with a superposition inspection apparatus. In this step, an applied mask confirmation step is simultaneously carried out with the superposition inspection apparatus. Thus, it is possible to provide a method of fabricating a semiconductor device including a superposition inspection step, capable of efficiently confirming an applied mask and improving the fabrication yield for the semiconductor device.
Abstract:
There is described a semiconductor device having a storage node capacitor structure suitable for rendering memory cells compact, and storage nodes are prevented from tilting. The device includes a storage node which has a vertical surface extending in the direction perpendicular to the surface of a semiconductor substrate, and a dielectric film for tilt prevention purposes which is brought into close contact with the side surface of the vertical surface and which prevents the vertical surface from tilting.