公开(公告)号：AU4214699A

公开(公告)日：1999-12-13

申请号：AU4214699

申请日：1999-05-27

Applicant: ROMPOWER INC

Inventor： JITARU IONEL

IPC: H01F27/06 ,  H05K1/02 ,  H05K1/05 ,  H05K1/16 ,  H05K7/20

Abstract: An electronic assembly comprising: a) an electronic board (234) having an opening therein, said electronic board (234) further including two pads (2552B) positioned on a first surface of said electronic board (234) proximate to said opening; b) a multilayer circuit board (232) having secured thereto a transformer, said multilayer circuit board (232) positioned such that a portion of a first surface of said multilayer circuit board (232) engages the first surface of said electronic board (234) such that a portion of a core (2310) of said transformer extends into the opening of said electronic board (234), said multilayer circuit board (232) having at least two channels (2524) there through, each of said channels (2524) aligned with one of said at least two pads (2552B) of said electronic board (234); and c) solder (2522) extending through said at least two channels (2524) in said multilayer circuit board (232), said solder (2522) bonded to the channel (2524) and to an associated pad (254B) on said electronic board (234).

公开(公告)号：RO121308B1

公开(公告)日：2007-02-28

申请号：RO200000080

申请日：1999-05-27

Applicant: ROMPOWER INC

Inventor： JITARU IONEL

IPC: H05K7/20 ,  H01F27/06 ,  H01L23/367 ,  H01L23/373 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18

Abstract: Invenţia prezintă o structură de încapsulare pentru componente electronice, care cuprinde un cablaj imprimat multistrat (28), având o parte superioară (28a) ?i o parte inferioară (28b) ?i straturi interioare; înfă?urări (50) ale elementului magnetic introduse în numitul cablaj, un miez magnetic (26a) pătrunzând prin numitul circuitimprimat multistrat prin numitele înfă?urări,componente care disipă putere (22), a?ezate pe un prim suport conductiv termic (48), fixat pe partea superioară a numitului cablaj imprimat multistrat (28) ?i conectat la treceri placate cu cupru(42), un al doilea suport conductiv termic (74), o placă metalică (32), o secţiune înălţată (104) a plăcii metalice ata?ată de numitul cablaj imprimat multistrat, printr-un material izolantconductiv termic (30), secţiunea înălţată (104) a plăcii metalice (32) este a?ezată sub primul suport conductiv termic (30) ?i un suport compresibil conductiv termic (34), a?ezat între miezul magnetic (26b) ?i secţiunea înălţată a plăcii metalice (104).

公开(公告)号：WO9962105A3

公开(公告)日：2000-06-29

申请号：PCT/US9911824

申请日：1999-05-27

Applicant: ROMPOWER INC

Inventor： JITARU IONEL

IPC: H01F27/06 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H01F27/06 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/141 ,  H05K1/165 ,  H05K1/182 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09572 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2201/10666 ,  H01L2924/00

Abstract: A package for power converters in which a multilayers circuit board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portions of the bottom layers are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic core (26a). The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiments of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The base plate has cutouts or cavities to accomodate the magnetic cores. A thermally conductive material is placed between the magnetic core (26a) and the metal plate on the bottom of the cavity.

Abstract translation: 电源转换器的封装，其中多层电路板可以容纳这些组件。 磁性元件的缠绕结合在多层电路板中。 顶层和底层的一些部分也支持电子元件。 一些组件被放置在顶层上，这可能不被用于磁绕组，从而减小了磁芯（26a）的占地面积。 功率耗散装置放置在通过连接顶层到底层涂覆多个铜的垫上。 通过这些热量从功率器件传递到PCB的另一侧。 在本发明的一些实施例中，热量可以进一步传递到经由导热绝缘体连接到多层电路板的金属板。 基板具有切口或空腔以容纳磁芯。 导热材料放置在磁芯（26a）和空腔底部上的金属板之间。

公开(公告)号：WO9962105A9

公开(公告)日：2000-07-27

申请号：PCT/US9911824

申请日：1999-05-27

Applicant: ROMPOWER INC

Inventor： JITARU IONEL

IPC: H01F27/06 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H01F27/06 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/141 ,  H05K1/165 ,  H05K1/182 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09572 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2201/10666 ,  H01L2924/00

Abstract: A package for power converters in which a multilayers circuit board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portions of the bottom layers are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic core (26a). The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiments of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The base plate has cutouts or cavities to accomodate the magnetic cores. A thermally conductive material is placed between the magnetic core (26a) and the metal plate on the bottom of the cavity.

Abstract translation: 一种用于电力转换器的封装，其中多层电路板保持部件。 磁性元件的绕组结合在多层电路板中。 底层的顶部和一些部分也支持电子部件。 一些部件被放置在顶层上，这可能不能用于磁性绕组，减少了磁芯（26a）的占地面积。 功率耗散器件放置在焊盘上，通过连接顶层到底层，镀有多种铜。 通过这些通过热量从功率器件传递到PCB的另一侧。 在本发明的一些实施例中，可以通过导热绝缘体将热量进一步转移到连接到多层电路板的金属板上。 基板具有用于容纳磁芯的切口或空腔。 将导热材料放置在磁芯（26a）和空腔底部的金属板之间。

公开(公告)号：WO9962105A8

公开(公告)日：2000-03-09

申请号：PCT/US9911824

申请日：1999-05-27

Applicant: ROMPOWER INC

Inventor： JITARU IONEL

IPC: H01F27/06 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K7/20 ,  H01L

CPC classification number: H05K1/0204 ,  H01F27/06 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/141 ,  H05K1/165 ,  H05K1/182 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09572 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2201/10666 ,  H01L2924/00

Abstract: A transformer group in which a multitude of transformers (110A and 110B) are used to supply energy to a single load. The transformers (110A and 110B) are connected in series; in order to assist in providing a "flux equalizing" effect, the invention includes a flux equalizer circuit (112A and 112B). The flux equalizer circuit (112A and 112B) provides a series of flux windings. Each flux winding is associated with a single transformer. The windings are arranged in parallel. In this manner, a balancing of the output of the transformers is obtained; the power output from each transformer is "sensed" by its associated flux winding which is "shared" with the other transformers via their own associated flux winding. Power is processed then through the secondary windings, rectifiers, and output filters to a common load.

Abstract translation: 一种变压器组，其中多个变压器（110A和110B）用于向单个负载供应能量。 变压器（110A和110B）串联连接; 为了有助于提供“通量均衡”效果，本发明包括一个通量均衡器电路（112A和112B）。 通量均衡器电路（112A和112B）提供一系列磁通绕组。 每个磁通绕组与单个变压器相关联。 绕组平行布置。 以这种方式，获得变压器的输出的平衡; 来自每个变压器的功率输出由其相关联的磁通绕组“感测”，其通过其自身的相关磁通绕组与其它变压器“共享”。 然后通过次级绕组，整流器和输出滤波器对功率进行处理，达到公共负载。