2.
    发明专利
    未知

    公开(公告)号:DE69214940T2

    公开(公告)日:1997-05-28

    申请号:DE69214940

    申请日:1992-03-24

    Applicant: ROSEMOUNT INC

    Abstract: A metal thin film bonds a semiconductor bonding region of a diaphragm layer to a ceramic bonding region of a high modulus support block. The arrangement isolates a pressure sensing diaphragm from undesired strain, improving sensor accuracy. A passageway through the support block couples the fluid pressure to the sensing diaphragm to deflect it. Capacitive coupling between the diaphragm and a capacitor plate on the support block sense the deflection and provide an output representative of pressure.

    3.
    发明专利
    未知

    公开(公告)号:DE69214940D1

    公开(公告)日:1996-12-05

    申请号:DE69214940

    申请日:1992-03-24

    Applicant: ROSEMOUNT INC

    Abstract: A metal thin film bonds a semiconductor bonding region of a diaphragm layer to a ceramic bonding region of a high modulus support block. The arrangement isolates a pressure sensing diaphragm from undesired strain, improving sensor accuracy. A passageway through the support block couples the fluid pressure to the sensing diaphragm to deflect it. Capacitive coupling between the diaphragm and a capacitor plate on the support block sense the deflection and provide an output representative of pressure.

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