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公开(公告)号：DE3785037T2
公开(公告)日：1993-08-05
申请号：DE3785037
申请日：1987-05-29
Applicant: ROSEMOUNT INC
Abstract: A capacitive pressure sensor that is fabricated by a batch process affords isolation for the sensing element and leads from the pressure media and provides stress isolation as well. The pressure sensor is made up of a sandwich construction including a silicon wafer which is etched from one side to make cavities in a plurality of desired locations to form deflecting diaphragms, one surface of which acts as a capacitor plate. A glass layer is metalized on both sides and has holes drilled in locations that align with the diaphragms formed on the silicon wafer. The glass layer is anodically bonded to the wafer to form capacitance gap of a few microns relative to the one surface of each diaphragm. The assembly of the metalized glass layer and the silicon wafer is in a preferred form sandwiched between two additional layers, and bonded together in a vacuum atmosphere. The four layer sandwich is then cut up into individual sensors. The initial assembly can be formed to provide dampening of the diaphragm response times and to minimize the likelihood of false signals at high frequency inputs.
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公开(公告)号：DE3785037D1
公开(公告)日：1993-04-29
申请号：DE3785037
申请日：1987-05-29
Applicant: ROSEMOUNT INC
Abstract: A capacitive pressure sensor that is fabricated by a batch process affords isolation for the sensing element and leads from the pressure media and provides stress isolation as well. The pressure sensor is made up of a sandwich construction including a silicon wafer which is etched from one side to make cavities in a plurality of desired locations to form deflecting diaphragms, one surface of which acts as a capacitor plate. A glass layer is metalized on both sides and has holes drilled in locations that align with the diaphragms formed on the silicon wafer. The glass layer is anodically bonded to the wafer to form capacitance gap of a few microns relative to the one surface of each diaphragm. The assembly of the metalized glass layer and the silicon wafer is in a preferred form sandwiched between two additional layers, and bonded together in a vacuum atmosphere. The four layer sandwich is then cut up into individual sensors. The initial assembly can be formed to provide dampening of the diaphragm response times and to minimize the likelihood of false signals at high frequency inputs.
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公开(公告)号：DE3482705D1
公开(公告)日：1990-08-16
申请号：DE3482705
申请日：1984-12-07
Applicant: ROSEMOUNT INC
Inventor： KNECHT A
Abstract: A transducer has a first and second sensing diaphragm configured such that a first pressure P1 is applied to the first diaphragm and a second pressure P2 is applied to the second diaphragm and wherein both diaphragms are formed on the same substantially flat face of a diaphragm wafer. The transducer is configured such that each diaphragm responsive to P1 or P2 respectively also affects a fluid in a closed common fluid cavity such that the deflection of the diaphragm is representative of the pressure differential (P1-P2).
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