公开(公告)号：WO2012036735A2

公开(公告)日：2012-03-22

申请号：PCT/US2011001586

申请日：2011-09-13

Applicant: ROSEMOUNT INC ,  PERRAULT AARON ANDREW ,  HERZOG DANIEL JUSTIN

Inventor： PERRAULT AARON ANDREW ,  HERZOG DANIEL JUSTIN

IPC: H05K5/02 ,  G05B23/02 ,  H05K7/14

CPC classification number: H05K7/1462 ,  G01D11/245 ,  Y10T29/49002

Abstract: A field device assembly (40; 40'; 40") includes a housing body (48), a first circuitry subassembly (54) mounted to the housing body (48) and positioned at least partially within the housing body (48), a first cover chassis (50A; 50B; 92) having a shoulder (94), mating flame path restricting structures (96A, 96B) positioned on the first cover chassis (50A; 50B; 92) and the housing body (48), a first threaded collar (52A; 52B) configured to fit about the first cover chassis (50A; 50B; 92) and to permit rotation relative to the first cover chassis (50A; 50B; 92), and a second circuitry subassembly (58A; 58B) secured to the first cover chassis (50A; 50B; 92). The first threaded collar (52A; 52B) is threadably engaged with the housing body (48), and includes an engagement structure (90) engaged with the shoulder (94) of the first cover chassis (50A; 50B; 92) to secure the first cover chassis (50A; 50B; 92) to the housing body (48). The second circuitry subassembly (58A; 58B) includes an electrical connector (60A; 62A) configured for linear insertion engagement with a mating electrical connector (60B; 62B) within the housing body (48) to electrically connect the first and second circuitry subassemblies.

Abstract translation: 现场设备组件（40; 40'; 40“）包括壳体本体（48），安装到壳体本体（48）并且至少部分地定位在壳体本体（48）内的第一电路子组件（54）， 具有肩部94的第一盖底盘50A; 50B; 92，位于第一盖底盘50A; 50B; 92上的配合火焰路径限制结构96A，96B;以及第一盖壳体50A， 以及第二电路子组件（58A; 58B），所述第一电路子组件（58A; 58B）被构造成围绕所述第一盖体（50A; 50B; 92）装配并且允许相对于所述第一盖体（50A; 50B; 92） （52A; 52B）与所述壳体主体（48）螺纹接合，并且包括与所述第一盖体（50A; 50B; 92）的肩部（94）接合的接合结构（90） （50A; 50B; 92）将第一盖体（50A; 50B; 92）固定到壳体主体（48）上;第二电路子组件（58A; 58B）包括第一壳体 ctrical连接器（60A; 62A），其构造成与壳体主体（48）内的配合电连接器（60B; 62B）线性插入接合以电连接第一和第二电路子组件。

公开(公告)号：CA2923141A1

公开(公告)日：2015-04-02

申请号：CA2923141

申请日：2014-08-05

Applicant: ROSEMOUNT INC

Inventor： NORMAN KIRSTEN NICOLE ,  PERRAULT AARON ANDREW ,  RUD JASON HAROLD ,  HOLMSTADT CLARENCE EDWARD

IPC: G01D11/24

Abstract: A field device (108) for use in an industrial process (100) includes a housing (110) having a cavity (112) formed therein. A humidity-sealed electronics module (126) has a first compartment (146) formed therein and is positioned in the cavity (112). The humidity-sealed electronics module (126) includes a seal board. The seal board separates the first compartment (146) of the humidity sealed electronics module (126) from a second compartment (130) in the housing (110). A first electrical component (124) in the first compartment (146) is mounted to the seal board and a second electrical component (122) in the second compartment (130) is electrically connected to the first electrical component (124).

公开(公告)号：CA2923141C

公开(公告)日：2018-03-13

申请号：CA2923141

申请日：2014-08-05

Applicant: ROSEMOUNT INC

Inventor： NORMAN KIRSTEN NICOLE ,  PERRAULT AARON ANDREW ,  RUD JASON HAROLD ,  HOLMSTADT CLARENCE EDWARD

IPC: G01D11/24

Abstract: A field device (108) for use in an industrial process (100) includes a housing (110) having a cavity (112) formed therein. A humidity-sealed electronics module (126) has a first compartment (146) formed therein and is positioned in the cavity (112). The humidity-sealed electronics module (126) includes a seal board. The seal board separates the first compartment (146) of the humidity sealed electronics module (126) from a second compartment (130) in the housing (110). A first electrical component (124) in the first compartment (146) is mounted to the seal board and a second electrical component (122) in the second compartment (130) is electrically connected to the first electrical component (124).

公开(公告)号：EP2972162A4

公开(公告)日：2016-10-26

申请号：EP14775768

申请日：2014-02-14

Applicant: ROSEMOUNT INC

Inventor： BRONCZYK ANDREW JAMES ,  PERRAULT AARON ANDREW ,  GREEN FRANK L

IPC: G01K1/08 ,  G01K1/14

CPC classification number: G01K1/08 ,  G01D21/00 ,  G01K1/024 ,  G01K2215/00

Abstract: A process sensor assembly comprises a hollow protective housing, a temperature sensor, a process transmitter, and a transient protector. The temperature sensor includes a probe extending out of the hollow protective housing to a sensing location, and a top plate movably secured to the hollow protective housing so as to allow travel within the hollow protective housing with vibrations of the probe. The process transmitter is configured to process and transmit sensor signals from the temperature sensor, and is retained on the top plate to move with the temperature sensor within the hollow protective housing. The transient protector is configured to condition power for to the process transmitter, and is anchored to the process transmitter so as to move with the process transmitter within the hollow protective housing.

公开(公告)号：EP2617274A4

公开(公告)日：2017-07-05

申请号：EP11825563

申请日：2011-09-13

Applicant: ROSEMOUNT INC

Inventor： PERRAULT AARON ANDREW ,  HERZOG DANIEL JUSTIN

IPC: H05K5/02 ,  G01D11/24 ,  G05B23/02 ,  H05K7/14

CPC classification number: H05K7/1462 ,  G01D11/245 ,  Y10T29/49002

Abstract: A field device assembly includes a housing body, a first circuitry subassembly mounted to the housing body and positioned at least partially within the housing body, a first cover chassis having a shoulder, mating flame path restricting structures positioned on the first cover chassis and the housing body, a first threaded collar configured to fit about the first cover chassis and to permit rotation relative to the first cover chassis, and a second circuitry subassembly secured to the first cover chassis. The first threaded collar is threadably engaged with the housing body, and includes an engagement structure engaged with the shoulder of the first cover chassis to secure the first cover chassis to the housing body. The second circuitry subassembly includes an electrical connector configured for linear insertion engagement with a mating electrical connector within the housing body to electrically connect the first and second circuitry subassemblies.

Abstract translation: 现场设备组件包括：壳体;第一电路子组件，其安装到壳体并至少部分地定位在壳体内;第一盖壳体，其具有台肩;配合火焰路径限制结构，其位于第一壳体底座上，并且壳体 第一螺纹套环，所述第一螺纹套环被构造成围绕所述第一盖体并且允许相对于所述第一盖体转动;以及第二电路子组件，其被固定到所述第一盖体上。 第一螺纹套环与壳体本体螺纹接合，并且包括接合结构，该接合结构与第一盖壳体的肩部接合以将第一壳体底架固定到壳体。 第二电路子组件包括电连接器，该电连接器被配置用于与壳体内的配合电连接器线性插入接合以电连接第一和第二电路子组件。

公开(公告)号：EP3014775A4

公开(公告)日：2017-03-29

申请号：EP14817327

申请日：2014-05-28

Applicant: ROSEMOUNT INC

Inventor： PERRAULT AARON ANDREW ,  HAUSLER GEORGE CHARLES ,  ZELASKO CRAIG DANIEL ,  SCHWARTZ DANIEL RONALD

IPC: H04B1/03

CPC classification number: H05K7/02 ,  G02F1/133308 ,  G06F1/1601 ,  G06F1/1607 ,  G06F1/1637 ,  G06F3/0488 ,  H05K7/1427 ,  H05K7/1462 ,  H05K13/0023 ,  Y10T29/49117

Abstract: A process transmitter housing assembly includes a housing and a cover assembly including a cover chassis and a transparent cover piece. The cover chassis includes a cover flange extending inward from a perimeter of the cover chassis. Internal threads of the cover chassis threadedly engage external threads of the housing. The transparent cover piece is mechanically clamped between the cover flange and a surface of the housing nearest the cover flange when the cover chassis is threadedly secured to the housing.

Abstract translation: 工艺变送器壳体组件包括壳体和包括盖底盘和透明盖件的盖组件。 盖底盘包括从盖底盘的周边向内延伸的盖凸缘。 盖底盘的内螺纹与外壳的外螺纹相啮合。 当盖底盘螺纹固定在外壳上时，透明盖件被机械地夹紧在盖凸缘和最靠近盖凸缘的壳体表面之间。

公开(公告)号：EP2972161A4

公开(公告)日：2016-10-26

申请号：EP14774169

申请日：2014-02-12

Applicant: ROSEMOUNT INC

Inventor： PERRAULT AARON ANDREW ,  DIERKER ANDREW STEVEN

IPC: G01K1/08 ,  G01K1/14

CPC classification number: G01K1/14 ,  G01K13/02

Abstract: A temperature sensing system comprises a thermowell, a sensor, and a solid insert. The thermowell extends into a sensing region of a fluid flow. The sensor has a probe housed in the thermowell to sense a temperature in the sensing region. The solid insert is configured to removably support the probe within the thermowell and to provide a thermal contact between the thermowell and the probe.