公开(公告)号：SG188094A1

公开(公告)日：2013-03-28

申请号：SG2013007521

申请日：2009-01-30

Applicant: RUDOLPH TECHNOLOGIES INC

Inventor： LE TUAN D

Abstract: HIGH RESOLUTION EDGE INSPECTIONSystems and methods of inspection for a substrate. At least two images of a selected portion of the substrate edge are captured using an optical imaging system, and each characterized by a discrete focal distance setting of the optical imaging system. A composite image of the substrate edge is formed from the at least two images. Defect(s) are identified in the composite image. Some optical systems can include at least one optical element having an optical power and a focusing mechanism for modifying a focal distance of the optical system.FIG. 2

公开(公告)号：WO2008103994A3

公开(公告)日：2009-12-30

申请号：PCT/US2008054913

申请日：2008-02-25

Applicant: RUDOLPH TECHNOLOGIES INC ,  CARLSON ALAN ,  PAI AJAY ,  LE TUAN D ,  PHILIP ANTONY RAVI

Inventor： CARLSON ALAN ,  PAI AJAY ,  LE TUAN D ,  PHILIP ANTONY RAVI

IPC: H01L21/461 ,  H01L21/66

CPC classification number: G06T7/0006 ,  G01N21/9501 ,  G01N21/9503 ,  G01N2021/8841 ,  G01R31/2831 ,  G01R31/303 ,  G06T2207/30148 ,  H01L21/67253

Abstract: Systems and method for monitoring semiconductor wafer fabrication processing, for example based upon EBR line inspection, including capturing at least one image of a wafer at an intermediate stage of fabrication. The captured image(s) are compressed to generate a composite representation of at least an edge zone of the wafer. An edge bead removal area is identified in the representation, and at least one feature attribute is extracted from the identified area. The extracted feature attribute is automatically assessed, and information relating to a status of the fabrication processing in generated based upon the assessment. For example, recommended modifications to the fabrication processing, either upstream or downstream of the current stage of fabrication (or both) can be generated and implemented.

Abstract translation: 用于监测半导体晶片制造处理的系统和方法，例如基于EBR线检查，包括在制造的中间阶段捕获晶片的至少一个图像。 捕获的图像被压缩以产生晶片的至少边缘区域的复合表示。 在表示中识别边缘珠去除区域，并且从识别的区域提取至少一个特征属性。 提取的特征属性被自动评估，以及与根据评估产生的制造处理的状态有关的信息。 例如，可以生成和实现对制造处理的推荐修改，即当前制造阶段（或两者）的上游或下游。