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公开(公告)号：SG11201505661XA
公开(公告)日：2015-08-28
申请号：SG11201505661X
申请日：2014-01-23
Applicant: RUDOLPH TECHNOLOGIES INC
Inventor： ROY RAJIV , GRANT DAVID , MARX DAVID S , CHU HANH
Abstract: A method for characterizing a microfabrication process and the product thereof is described. A substrate having TSV's formed therein is assessed by determining the geometries and positions of the top and bottom ends of a TSV. Individual TSV's as well as the entire pattern of TSV's formed in a substrate may be assessed.
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