公开(公告)号：EP1198401A1

公开(公告)日：2002-04-24

申请号：EP00941212.3

申请日：2000-06-02

Applicant: Robotic Vision Systems Inc.

Inventor： Hernandez, William

IPC: B65G53/50

CPC classification number: B23K3/0623 ,  B23K2201/36

Abstract: An apparatus (10) is provided for supplying solder balls (12) to a receptacle (14). The apparatus (10) includes a reservoir (16) for storing the solder balls (12) and a flow path (38). The flow path includes a first end (40) connected to and in fluid communication with the reservoir (16) and a second end (42) for supplying the solder balls to the receptacle. The apparatus includes a flow actuator (46) in fluid communication with the flow path (38) to actuate the flow of the solder balls (12) from the reservoir (16) through the flow path (38) to the receptacle (14). A trap is disposed in the flow path (38) for trapping the solder balls (12) and stopping the flow of the solder balls to the receptacle (14) when the flow actuator (46) is not actuated. Related methods are disclosed.