公开(公告)号：US08961678B2

公开(公告)日：2015-02-24

申请号：US13722768

申请日：2012-12-20

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Qin Tang ,  Kit Ho Tong ,  Chit Yiu Chan ,  Martin W. Bayes

IPC: C09D7/12 ,  H01L21/02 ,  C23C22/52 ,  C23F11/08 ,  C23F11/14 ,  H05K3/28

CPC classification number: C09D7/1233 ,  C09D7/63 ,  C23C22/52 ,  C23F11/08 ,  C23F11/149 ,  H01L21/02304 ,  H05K3/282 ,  H05K2203/124

Abstract: An organic solderability preservative solution includes pyrazine derivatives which inhibit corrosion of metal. The solution is applied to metal surfaces of components for electronic apparatus to improve solderability of electrical connections between the components in the electronic apparatus.

Abstract translation: 有机可焊性防腐剂溶液包括抑制金属腐蚀的吡嗪衍生物。 该解决方案被应用于用于电子设备的部件的金属表面，以改善电子设备中部件之间的电连接的可焊性。

公开(公告)号：US20170181292A1

公开(公告)日：2017-06-22

申请号：US15375592

申请日：2016-12-12

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Qin Tang ,  Kit Ho Tong ,  Chit Yiu Chan ,  Kowk-Wai Yee

IPC: H05K3/28 ,  C23C18/16 ,  C23C18/18 ,  C09D5/08

CPC classification number: H05K3/282 ,  C09D5/08 ,  C23C18/1637 ,  C23C18/168 ,  C23C18/1834 ,  C23C22/58 ,  C23F11/08 ,  C23F11/149 ,  H05K2203/0591 ,  H05K2203/0703

Abstract: A method for forming an organic coating on a surface of nickel or nickel alloy is disclosed. The method includes contacting the nickel surface with a composition comprising a specific pyrazine derived compound to prevent corrosion of nickel without forming known gold emersion film on the surface of the nickel.

公开(公告)号：US20170183783A1

公开(公告)日：2017-06-29

申请号：US15375612

申请日：2016-12-12

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Qin Tang ,  Kit Ho Tong ,  Chit Yiu Chan ,  Kwok Wai Yee

IPC: C23F11/00 ,  H05K1/03 ,  H05K3/28 ,  H05K1/09 ,  C09D5/08 ,  C09D7/12

CPC classification number: C23F11/00 ,  C09D5/086 ,  C09D7/48 ,  C23C22/52 ,  C23F11/08 ,  C23F11/149 ,  H05K1/0346 ,  H05K1/09 ,  H05K3/282 ,  H05K2203/0392 ,  H05K2203/0591 ,  H05K2203/124

Abstract: A method for selective deposition of an organic solderability preservative coating on a copper surface of an article is disclosed. The method includes two steps of organic coatings by two solutions; the first step contains contacting the copper surface with a first solution including azole compound and the second step contains contacting the copper surface treated by the first solution with a second solution including a specific pyrazine derived compound.