OVERLAP HELICAL CONDUCTIVE SPRING
    1.
    发明申请
    OVERLAP HELICAL CONDUCTIVE SPRING 审中-公开
    OVERLAP HELIC导电弹簧

    公开(公告)号:WO2010102280A2

    公开(公告)日:2010-09-10

    申请号:PCT/US2010026502

    申请日:2010-03-08

    CPC classification number: F16F1/06 F16F1/045 F16F1/065

    Abstract: A cross-diametric compression spring includes a conductive ribbon formed into an overlapping helical coil wherein adjacent loops of the conductive ribbon overlap. The conductive ribbon has a width extending substantially parallel to length of the overlapping helical coil.

    Abstract translation: 交叉直径压缩弹簧包括形成为重叠螺旋线圈的导电带,其中导电带的相邻环重叠。 导电带具有基本上平行于重叠的螺旋线圈的长度延伸的宽度。

    MODULAR POLYMERIC EMI/RFI SEAL
    2.
    发明申请
    MODULAR POLYMERIC EMI/RFI SEAL 审中-公开
    模块化POLYMERIC EMI / RFI密封

    公开(公告)号:WO2011041781A3

    公开(公告)日:2011-08-18

    申请号:PCT/US2010051319

    申请日:2010-10-04

    CPC classification number: F16J15/3212 F16J15/3236

    Abstract: A seal includes a seal body including an annular cavity, and an annular spring within the annular cavity. The seal body, the seal body includes a composite material having a thermoplastic material and a filler. The composite material can have a Young's Modulus of at least about 0.5 GPa, a volume resistitivity of not greater than about 200 Ohm-cm, an elongation of at least about 20%, a surface resistitivity of not greater than about 104Ohm/sq, or any combination thereof.

    Abstract translation: 密封件包括包括环形空腔的密封体和环形空腔内的环形弹簧。 密封体,密封体包括具有热塑性材料和填料的复合材料。 复合材料可以具有至少约0.5GPa的杨氏模量,不大于约200Ohm-cm的体积电阻率,至少约20%的伸长率,不大于约104Ohm / sq的表面电阻率,或 其任何组合。

    MODULAR POLYMERIC EMI/RFI SEAL
    3.
    发明专利

    公开(公告)号:CA2775731A1

    公开(公告)日:2011-04-07

    申请号:CA2775731

    申请日:2010-10-04

    Abstract: A seal includes a seal body including an annular cavity, and an annular spring within the annular cavity. The seal body, the seal body includes a composite material having a thermoplastic material and a filler. The composite material can have a Young's Modulus of at least about 0.5 GPa, a volume resistitivity of not greater than about 200 Ohm-cm, an elongation of at least about 20%, a surface resistitivity of not greater than about 104Ohm/sq, or any combination thereof.

    vedação de emi/rfi polimérica modular.

    公开(公告)号:BR112012006139A2

    公开(公告)日:2016-06-28

    申请号:BR112012006139

    申请日:2010-10-04

    Abstract: trata-se de uma vedação que inclui um corpo de vedação que inclui uma cavidade anular, e uma mola anular dentro da cavidade anular. o corpo de vedação, o corpo de vedação inclui um material compósito que tem um material termoplástico e uma carga. o material compósito que tem um material termoplástico e uma carga. o material compósito pode ter um módulo de young de pelo menos cerca de 0,05 gpa, uma resistividade de volume não maior do que cerca de 20%, uma resistividade de superfície não maior do que cerca de 10^ 4^ ohm/quadrado, ou qualquer combinação disso.

    УПЛОТНЕНИЕ, СОДЕРЖАЩАЯ ЕГО СИСТЕМА И СПОСОБ ИЗГОТОВЛЕНИЯ УПЛОТНЕНИЯ

    公开(公告)号:RU2504933C2

    公开(公告)日:2014-01-20

    申请号:RU2012114194

    申请日:2010-10-04

    Abstract: Уплотнение, преимущественнодлясниженияпомехэлектронногошумаи радиочастотныхпомех (EMI/RFI), содержиткорпусуплотнения, имеющийкольцевуюполость, атакжекольцевуюпружину, находящуюсяв кольцевойполости. Корпусуплотнениявключаеткомпозиционныйматериал, содержащийтермопластичныйматериали наполнитель. КомпозиционныйматериалможетиметьмодульупругостиЮнгапоменьшеймереприблизительно 0,5 ГПа, объемноеудельноесопротивлениенеболеечемприблизительно 200 Ом·см, относительноеудлинениепоменьшеймереприблизительно 20%, поверхностноеудельноесопротивлениенеболеечемприблизительно 10Ом/квадратилилюбуюихкомбинацию. Повышениенадежностиработыэлектронныхсистемзасчетвозможностиконтроляи снижения EMI, мешающихработеэлектроннойсистемы, являетсятехническимрезультатомзаявленногоизобретения. 4 н. и 12 з.п. ф-лы, 7 ил., 1 табл.

    MODULAR POLYMERIC EMI/RFI SEAL
    7.
    发明专利

    公开(公告)号:SG179014A1

    公开(公告)日:2012-04-27

    申请号:SG2012015798

    申请日:2010-10-04

    Abstract: A seal includes a seal body including an annular cavity, and an annular spring within the annular cavity. The seal body, the seal body includes a composite material having a thermoplastic material and a filler. The composite material can have a Young's Modulus of at least about 0.5 GPa, a volume resistitivity of not greater than about 200 Ohm-cm, an elongation of at least about 20%, a surface resistitivity of not greater than about 104Ohm/sq, or any combination thereof.

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