CHEMICAL MECHANICAL POLISHING RETAINING RING
    1.
    发明申请
    CHEMICAL MECHANICAL POLISHING RETAINING RING 审中-公开
    化学机械抛光保持环

    公开(公告)号:WO2005092010A2

    公开(公告)日:2005-10-06

    申请号:PCT/US2005009195

    申请日:2005-03-18

    CPC classification number: B24B37/32 B23H5/08

    Abstract: In one embodiment, the disclosure is directed to a chemical mechanical polishing retaining ring. The chemical mechanical polishing retaining ring includes a support formed of a first material comprising a first polymer and a wear portion formed of a second material comprising a second polymer. The first material has an elastic modulus greater than the elastic modulus of the second material.

    Abstract translation: 在一个实施例中,本公开涉及化学机械抛光保持环。 化学机械抛光保持环包括由包括第一聚合物的第一材料形成的支撑体和由包含第二聚合物的第二材料形成的耐磨部分。 第一材料的弹性模量大于第二材料的弹性模量。

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