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公开(公告)号：WO2022133403A1
公开(公告)日：2022-06-23
申请号：PCT/US2021/072820
申请日：2021-12-09
Inventor： ADAMCHUK, Jennifer , THOMAS, Dale , WHITE, Meghann , RAVICHANDRAN, Sethumadhavan , BUSS, Gerard T.
Abstract: The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
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公开(公告)号：WO2022133402A1
公开(公告)日：2022-06-23
申请号：PCT/US2021/072819
申请日：2021-12-09
Inventor： ADAMCHUK, Jennifer , THOMAS, Dale , WHITE, Meghann , RAVICHANDRAN, Sethumadhavan , BUSS, Gerard T.
Abstract: The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.
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Patent Agency Ranking
公开(公告)号：WO2022133404A1
公开(公告)日：2022-06-23
申请号：PCT/US2021/072822
申请日：2021-12-09
Inventor： ADAMCHUK, Jennifer , THOMAS, Dale , WHITE, Meghann , RAVICHANDRAN, Sethumadhavan , BUSS, Gerard T.
Abstract: The present disclosure relates to a copper-clad laminate that may include a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.
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公开(公告)号：WO2015164624A1
公开(公告)日：2015-10-29
申请号：PCT/US2015/027327
申请日：2015-04-23
Inventor： MCNAMARA, Brian , COOKE, Edward , MICIULA-OSAK, Marta , HUTCHESON, Ian D. , THOMAS, Dale , REDER, Joachim , PADWAL, Ajay
CPC classification number: C08J5/04 , C08J2327/18 , D06M15/256 , F16C33/122 , F16C2208/02 , F16C2208/30
Abstract: The present disclosure is directed to composite structures, such as low friction liners, exhibiting superior performance. In certain embodiments of the present disclosure, a composite structure can include a first outer major surface adapted to contact a movable surface, and a second outer major surface adapted to contact a stationary surface, wherein the first outer major surface has a lower surface roughness than the second outer major surface, and wherein the composite has a mean average thickness of less than 0.3 mm. The composite structure can have unexpected synergistic improvement in properties such as low surface roughness, high dielectric strength, high resistance to edge wicking, high resistance to surface wicking, low content of surface defects, an increased abrasion resistance, and combinations thereof, particularly the maintenance of these properties over a long life.
Abstract translation: 本公开涉及复合结构，例如低摩擦衬垫，表现出优异的性能。 在本公开的某些实施例中，复合结构可以包括适于接触可移动表面的第一外主表面和适于接触固定表面的第二外主表面，其中第一外主表面具有比 第二外主表面，并且其中复合材料的平均平均厚度小于0.3mm。 复合结构可以在诸如低表面粗糙度，高介电强度，高耐边缘芯吸，高抗表面芯吸，低含量的表面缺陷，增加的耐磨性及其组合的性能方面具有意想不到的协同改进，特别是维护 的这些属性在长寿命。
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公开(公告)号：EP4265074A1
公开(公告)日：2023-10-25
申请号：EP21908005.8
申请日：2021-12-09
Inventor： ADAMCHUK, Jennifer , THOMAS, Dale , WHITE, Meghann , RAVICHANDRAN, Sethumadhavan , BUSS, Gerard T.
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公开(公告)号：EP4265075A1
公开(公告)日：2023-10-25
申请号：EP21908006.6
申请日：2021-12-09
Inventor： ADAMCHUK, Jennifer , THOMAS, Dale , WHITE, Meghann , RAVICHANDRAN, Sethumadhavan , BUSS, Gerard T.
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公开(公告)号：EP4265073A1
公开(公告)日：2023-10-25
申请号：EP21908004.1
申请日：2021-12-09
Inventor： ADAMCHUK, Jennifer , THOMAS, Dale , WHITE, Meghann , RAVICHANDRAN, Sethumadhavan , BUSS, Gerard T.
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