公开(公告)号：KR20200140030A

公开(公告)日：2020-12-15

申请号：KR20190066698

申请日：2019-06-05

Applicant: SAMSUNG ELECTRONICS CO LTD

Inventor： DAEHEE PARK ,  DONGIL SON ,  JUNGMIN PARK ,  CHONGHWA SEO ,  HYOUNGJOO LEE

IPC: H01Q3/26 ,  H04M1/02

Abstract: 본발명의다양한실시예들은, 전자장치의동작방법에관한것으로, 복수의안테나모듈들중 제1 안테나모듈의사용이불가능함을확인하는동작, 복수의안테나모듈들에대한제1 빔셋을제1 안테나모듈의커버리지의적어도일부를커버하기위한적어도하나의서브빔을포함하는제2 빔셋으로변경하는동작, 및제2 빔셋에기반하여통신을수행하는동작을포함할수 있다. 이밖에다양한실시예들이가능하다.

公开(公告)号：MY192804A

公开(公告)日：2022-09-09

申请号：MYPI2018702402

申请日：2017-02-17

Applicant: SAMSUNG ELECTRONICS CO LTD

Inventor： HYOUNGJOO LEE ,  KEE HOON KIM ,  BYUNG GIL LEE ,  CHAIMAN LIM

IPC: H04B7/08 ,  H04W72/04

Abstract: An electronic device is provided. The electronic device includes a plurality of antennas (301, 302, 303, 304), a radio frequency (RF) circuit (320) configured to electrically connect with the plurality of antennas (301, 302, 303, 304), and a processor (310). The plurality of antennas (301, 302, 303, 304) include a first main antenna, a first sub-antenna, a second main antenna, and a second sub-antenna. The processor controls the RF circuit (320) to operate in a first mode of receiving a signal using the first main antenna and the first sub-antenna. The processor controls the RF circuit (320) to operate in a second mode different from the first mode to receive the signal based on a signal state.

公开(公告)号：US20240170449A1

公开(公告)日：2024-05-23

申请号：US18213018

申请日：2023-06-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYOUNGJOO LEE ,  SANG-SICK PARK ,  CHUNGSUN LEE ,  SEUNGYOON JUNG

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L24/83 ,  H01L24/08 ,  H01L24/09 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/0801 ,  H01L2224/0903 ,  H01L2224/09517 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81097 ,  H01L2224/81203 ,  H01L2224/83097 ,  H01L2224/83203 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/351

Abstract: A method includes providing a first structure, forming a connection pad on the first structure, forming a preliminary connection member on the connection pad, forming an adhesion layer on the first structure, the adhesion layer covering the preliminary connection member, removing a portion of the adhesion layer to expose an exposure surface of the preliminary connection member, providing a second structure, forming a chip pad and a dummy pad on the second structure, and covering the chip pad and the dummy pad with the adhesion layer that has been formed on the first structure. A thickness of the dummy pad is greater than a thickness of the chip pad.