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公开(公告)号：US20240178548A1
公开(公告)日：2024-05-30
申请号：US18521234
申请日：2023-11-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Wangik SON , Jungsik PARK , Incheol BAEK , Sunghyup LEE , Dongwoo SEO , Youngsoo CHUN , Byengsang JUNG
Abstract: An electronic device includes a housing, a circuit board, a first electronic component, a first conductive plate, and a first antenna. The housing includes a support member and a side frame surrounding a periphery of the support member. The support member includes a first conductive area. The circuit board is disposed on a surface of the support member and includes a feeding point on a surface of the circuit board. The first electronic component is disposed on the surface of the support member. The first conductive plate is disposed on a surface of the first electronic component. The first conductive area is disposed between the first electronic component and the side frame. The first antenna includes a first radiator, a first feeding part, and a first signal terminal. At least a portion of the first electronic component is disposed between the first conductive area and the circuit board.
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公开(公告)号：US20230188888A1
公开(公告)日：2023-06-15
申请号：US18164057
申请日：2023-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngbae PARK , Changshik YOON , Kiwon KIM , Joohan KIM , Taeeon KIM , Jinju BAE , Incheol BAEK , Myungcheol LEE
CPC classification number: H04R1/28 , H04R1/44 , H04R2499/11
Abstract: An electronic device includes a speaker module which includes a speaker unit and a first speaker housing that is coupled to the speaker unit in a first direction. The first speaker housing accommodates the speaker unit, and is arranged in the inner space of the electronic device. A soundproof device allows the inner space of the electronic device to communicate with the outside, and an acoustic passage connects the soundproof device and a portion from which a sound is radiated by the speaker unit of the speaker module. The speaker module can further include an airtight member for sealing a gap between the speaker module and the acoustic passage so that the sound radiated from the speaker unit is transmitted to the acoustic passage.
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公开(公告)号：US20240314493A1
公开(公告)日：2024-09-19
申请号：US18642986
申请日：2024-04-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kiwon KIM , Choonghyo PARK , Incheol BAEK , Jihoon SONG , Seongkwan YANG , Sungsoo JUN , Byounghee LEE , Joonrae CHO , Hochul HWANG
CPC classification number: H04R1/2857 , H04M1/035 , H04R1/345 , H04R2499/11
Abstract: An electronic device is disclosed, including a housing including a first surface, a second surface facing away from the first surface, and a side surface structure at least partially surrounding a space formed between the first surface and the second surface, an acoustic hole formed in the housing and configured to emit a sound in a direction the first surface faces, a speaker disposed in the housing, and a first acoustic waveguide and a second acoustic waveguide together providing an acoustic path between the speaker and the acoustic hole, wherein the second acoustic waveguide is different from the first acoustic waveguide.
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公开(公告)号：US20240155274A1
公开(公告)日：2024-05-09
申请号：US18365434
申请日：2023-08-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Incheol BAEK , Jungsik PARK
CPC classification number: H04R1/02 , H05K7/2039 , H04R2499/11
Abstract: An electronic device includes: a housing, a speaker, and an enclosure surrounding the speaker, the enclosure including a heat dissipation portion comprising a thermally conductive material facing the speaker and spaced apart from the speaker. The electronic device includes a support disposed between the speaker and the enclosure, the support including a first portion disposed on the speaker, a second portion facing the heat dissipation portion in the enclosure, and a third portion connecting the first portion and the second portion. An area of the first portion may be greater than an area of the second portion.
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公开(公告)号：US20230026128A1
公开(公告)日：2023-01-26
申请号：US17859221
申请日：2022-07-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jaehwan LEE , Jeonggyu JO , Incheol BAEK
Abstract: An electronic device and method for generating an audio signal is provided. According to various example embodiments, an electronic device may include a display configured to depict visual information to the outside of the electronic device. The electronic device further includes an actuator to cause the display to vibrate. A processor is electrically connected to the actuator and the display. The processor applies a pilot signal to the actuator, and detects an amount of vibration of the display caused by applying the pilot signal. The processor sets an environment of the audio signal based on the amount of vibration of the display.
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Patent Agency Ranking
6.发明公开公开(公告)号：US20240036182A1
公开(公告)日：2024-02-01
申请号：US18486162
申请日：2023-10-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jeonggyu JO , Jaehwan LEE , Incheol BAEK , Dongil SON
IPC: G01S11/14 , G06F1/3206 , G10L15/28
CPC classification number: G01S11/14 , G06F1/3206 , G10L15/28
Abstract: An electronic device, according to various embodiments, includes: an application processor including an audio processing module and a voice recognition module; a mic; a speaker; and a sensor hub. While the audio processing module included in the application processor is in a sleep state, the sensor hub generates an ultrasonic signal and provides the ultrasonic signal to the speaker so that the speaker outputs a first signal including the ultrasonic signal therethrough; receives, from the voice recognition module, a second signal inputted through the mic; and determines whether an object is near the electronic device, at least on the basis of the first signal and the second signal.
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公开(公告)号：US20230143417A1
公开(公告)日：2023-05-11
申请号：US17980940
申请日：2022-11-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Woojin CHO , Kiwon KIM , Myeungseon KIM , Youngbae PARK , Incheol BAEK , Sunyoung LEE
IPC: H04R1/28
CPC classification number: H04R1/288 , H04R1/2857 , H04R2499/11
Abstract: An electronic device is provided. The electronic device includes: a housing at least partially surrounding a space between a front surface and a rear surface of the electronic device, and including a side structure through which a speaker hole is formed; a speaker configured to emit a sound signal through the speaker hole; a vibration motor structure provided adjacent the speaker, and including a plurality of side surfaces, wherein a motor ventilation hole is formed through a first side surface of the plurality of side surfaces; an enclosure provided in the housing, and surrounding at least a portion of the speaker and at least a portion of the vibration motor structure; a sound absorbing structure provided in the enclosure; and a protection structure provided in the enclosure, and overlapping at least a portion of the motor ventilation hole.
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公开(公告)号：US20210092528A1
公开(公告)日：2021-03-25
申请号：US17019643
申请日：2020-09-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaehwan LEE , Hoyeong LIM , Incheol BAEK , Gihoon LEE , Yonghwa KIM , Hyunwoo SIM
Abstract: An electronic device is provided. The electronic device includes a housing, a display that is visually exposed through one surface of the housing and that includes a display panel including a pixel array and a layer group including a plurality of layers stacked on the display panel, a printed circuit board disposed in the housing, a piezo unit attached to a rear surface of the display panel, and a flexible printed circuit board (FPCB) that is connected to the piezo unit and that extends to the printed circuit board, the flexible printed circuit board including a coil that surrounds at least part of the piezo unit.
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公开(公告)号：US20250113141A1
公开(公告)日：2025-04-03
申请号：US18979929
申请日：2024-12-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Myoungsung SIM , Woojin CHO , Youngbae PARK , Incheol BAEK , Kiwon KIM , Jihoon SONG , Joonrae CHO , Byounghee LEE , Hochul HWANG
IPC: H04R1/28
Abstract: An electronic device includes a housing including a first surface, a second surface, and a third surface; a supporting structure; a speaker including a first surface at least partially contacted with a portion of the supporting structure and a second surface; a support contacted with a portion of the second surface of the speaker; and a sealing sheet between the support and the second surface of the housing. The support includes: a first portion and a second portion. A first space is provided between the sealing sheet and the first portion of the support. A second space is provided between the second surface of the speaker and the second portion of the support. The first space is connected to the second space wherein the first space is a resonant space for audio signals.
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公开(公告)号：US20230044807A1
公开(公告)日：2023-02-09
申请号：US17968088
申请日：2022-10-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaehwan LEE , Hoyeong LIM , Cheolyoon CHUNG , Hyunseok KIM , Incheol BAEK , Yongseung YI
Abstract: Disclosed is an electronic device including: a USB connector connected to a USB plug of an external device; a high-speed interface; a voltage source for supplying a voltage to the high-speed interface; a first circuit portion connected to a ground portion, and has a second impedance higher than a first impedance of the high-speed interface; and a processor. The processor is configured to monitor the external device by using the high-speed interface in a first interval of a first frame, form a disconnection sensing path by forming a connection between the first circuit portion and a second circuit portion of the external device, and use the disconnection sensing path to determine whether the connection between the USB connector and the USB plug has been disconnected. The second circuit portion may have a fourth impedance higher than a third impedance of an external high-speed interface. Various other embodiments are also possible.
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