公开(公告)号：US20250019135A1

公开(公告)日：2025-01-16

申请号：US18901665

申请日：2024-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wooram HONG ,  Hyun Do CHOI ,  Dal HEO ,  Youngchun KWON ,  Hyukju KWON ,  Gahee KIM ,  Bosung KIM ,  Jeonghun KIM ,  Jin Woo KM ,  Min Sik PARK ,  Youngjin PARK ,  Hyungtae SEO ,  Won Seok OH ,  Dongseon LEE ,  Sangyoon LEE ,  Jaejun CHANG ,  Jun Won JANG ,  Hyunjeong JEON ,  Joon-Kee CHO ,  Byung-Kwon CHOI ,  Won Je CHOI ,  Younsuk CHOI ,  Taesin HA

IPC: B65D51/00 ,  B65D51/20

Abstract: A sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.