公开(公告)号：WO2022217146A1

公开(公告)日：2022-10-13

申请号：PCT/US2022/024275

申请日：2022-04-11

Applicant: SAMTEC, INC.

Inventor： BOHN, Christopher David ,  CRAIN, Mark ,  ROEHM, Justin ,  HAMMANN, Thomas Jacob ,  ROBERTSON, Nathan ,  BROWN, Jeremy ,  PELKEY, Christopher ,  OWENS, Adam ,  PAYTON, Russell ,  FRANK, Russell

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/00

Abstract: A substrate is provided that includes a substrate body made of a material such as glass, and at least one electrical via that can extend at least into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies to establish electrical conductivity through the via. The melting temperature of the metal is less than the transition temperature and melting temperature of the substrate body.