-
公开(公告)号：WO2019099450A1
公开(公告)日：2019-05-23
申请号：PCT/US2018/060929
申请日：2018-11-14
Applicant: SAMTEC INC.
Inventor： DUNLOP, James
Abstract: An electrical component is configured to allow electrical cables to be mounted directly to a package substrate, such that electrical traces of the package substrate directly place the electrical cables in electrical communication with an integrated circuit that is mounted to the package substrate without passing through any separable interfaces of an electrical connector.
Search Results
1
records
(took 0.02 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
